Comparison ledger
Semitool 003163-000 SRD, Tokyo Electron Clean Track Act 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 003163-000 SRDSemitool | Clean Track Act 8Tokyo Electron |
|---|---|---|
| OEM | Semitool | Tokyo Electron |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | Interface Unit (IRA) for Canon FPA-3000 i5 stepper including one multi-buffer unit and Wafer edge exposure (WEE) |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 1997– |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1999 Vintage · 2001 Vintage · 2002 Vintage |
| Control system | — | — |
| Generation | — | — |
| Family | Semitool 003163-000 SRD | Tokyo Electron Clean Track |
| Cited variants | — | |
| Specifications | ||
| Make | Semitool[4] | — |
| Model | 003163-000[4] | Clean Track Act 8[3] |
| Equipment type | Spin Rinse Dryer (SRD)[4] | — |
| Asset # | 139375[4] | — |
| Last Confirm Date | September 03, 2025[4] | — |
| Configuration | — | Single Block[3] |
| Water Flow | — | Left to Right[3] |
| Wafer size | — | Interface Unit (IRA) for Canon FPA-3000 i5 stepper including one multi-buffer unit and Wafer edge exposure (WEE)[3] |
| Software Version | — | 1.18.003[5] |
| Wafer sizes | — | 6 inch, 8 inch, 100 mm, 150 mm[2] |
| Number of cassette ports | — | 4 (2 for 100 mm, 2 for 150 mm)[6] |
| Spinning units | — | BCT (bottom coater), COT (coater), DEV (developer)[6] |
| Thermal plates | — | LHP, HHP, HCP, ADH, PHP, TRS, TCP[6] |
| Software | — | TEL GEM, Cascade wafer flow, system log down[3] |
| CIM interface | — | SECS[5] |
| Handler system | — | CRA, PRA[5] |
| Factory interface | — | SMIF[5] |
| Interface for stepper | — | Interface Unit (IRA) for Canon FPA-3000 i5 including multi-buffer and WEE[3] |
| OEM | — | Tokyo Electron[3] |
| Category hint | — | Wet Processing / Clean[3] |
| Water flow direction | — | Left to right[3] |
| Interface unit | — | Interface Unit (IRA) for Canon FPA-3000 i5 stepper including one multi-buffer unit and Wafer edge exposure (WEE)[3] |
| Temperature & humidity control | — | Temperature & Humidity control unit for Coater[3] |
| Software package | — | TEL GEM on-line software; Cascade wafer flow software; System log down software[3] |
| CIM | — | SECS[5] |
| Block configuration | — | Dual block - 2C / 2D[2] |
Plan your fab
Building a Wet Processing / Clean process? Get a complete equipment list.
Open the fab equipment planner →