Shinkawa
UTC 300 BI alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
Logitech
1 WBS 1 Wafer Substrate
Packaging & Bonding
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
Branson
101-149-053 Gold Booster
Packaging & Bonding
West Bond
10100
Packaging & Bonding
West Bond
10490
Packaging & Bonding
The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.
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