Packaging & Bonding

The Disco DFL7340 is a stealth dicing system used for silicon wafer dicing.

The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.

The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.

The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.

The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.

The Shinkawa UTC 3000 WE Bonder is a wire bonder for 8-inch wafers.

Finetech Lambda is a die bonder with sub-micron placement accuracy, supporting thermocompression and ultrasonic bonding.

The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.

The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.

The Besi Datacon 2200 EVO is a high-accuracy multi-chip die bonder for die attach and flip chip applications.

The WestBond 7476 D 79 is a manual wedge-wedge wire bonding system used to create electrical interconnections between microfabricated devices, semiconductor chips, and external packages.

The ASM AD 896 M is a die bonder.

The WestBond 2426 B is a semi-automatic wire bonder.

The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.

The Esec DB 2100 FC HS is a die bonder used in semiconductor packaging.

The Besi / Datacon 2200 EVO is a die bonder hybrid.

The Besi / Datacon 2200 APM is a die attach / flip chip machine.

The Besi / Datacon 2009 SSI E is a die bonder described as a soft solder wire dispense system with a single wafer loader and magazine-to-magazine handling.

The F&K Delvotec G 5 62000 is a wire bonder described as running with 25 µm wire and a ball/wedge bondhead.