Packaging & Bonding

MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.

The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.

The K&S 4524 D is a Digital Series manual wire bonder.

The ESEC ESEC_2100HS is an automatic epoxy die bonder. The ESEC ESEC_2100HS appears in the category of semiconductor assembly die bonders.

The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.

The ESEC_2100XP is an automatic epoxy die bonder in the semiconductor assembly and die bonder category.

The West Bond 7372E is a dual-head die bonder in the E-Series line.

The West Bond K 1200 P is a semiconductor manufacturing equipment unit cataloged under asset number 136359.

The West Bond 7700E Series is a manual ball-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices.

The West Bond Model 7700E Series is a manual thermosonic ball-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices.

The SUSS SB 6 E is a semi-automatic substrate bonder designed for aligned and unaligned wafer, substrate, and chip bonding using thermo-compression, anodic, fusion, adhesive, and related technologies.

The West Bond 5700 is a wire bonder in the West-Bond equipment line.

The SB8 Gen2 is part of SUSS MicroTec's high-precision bonding solutions, built on a scalable, modular platform for reliable permanent bonding outcomes.

The West Bond 7200 is a Pick & Place Epoxy Die Bonder series, with listed variants including the 7200A, 7200AA, 7200AD, 7200Head, and 7200AR.

The West Bond 7600B is a manual deep-access wedge wire bonder.

The West Bond 7400B is a manual wedge wire bonder.

The West Bond 7600C is a deep access 90° feed wedge wire bonder.

The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.

The EVG 850 TB Temporary Wafer Bonder is a tool for temporary wafer bonding, supporting 6-inch wafers.

The Datacon 2200 evo is a die bonder for epoxy die attach applications.

The Datacon 8800 CHAMEO ultra plus AC is grouped under Die Attach Hybrid Bonding in Besi's product portfolio.

The Esec 2100 SC is a die bonder for die attach and chip attachment applications. The Esec 2100 SC is a 300 mm high-speed platform with epoxy bonding, 50 N bond force, and 25 µm placement accuracy.

The 9800 TC next is an AC thermo compression bonding product listed by Besi in the die-attach segment of its products and technology portfolio.

The Esec 2100 sD advanced i is a die bonder for epoxy die attach with a 4" to 12" wafer size range. The Esec 2100 sD advanced i includes a Device Height Sensor, a High Precision Bond Head, and a Dual Dispensing Module.

The Sumitomo SH 100 NIV.A is a horizontal injection molding machine described as a picker machine with auto-gate cutting, a conveyor, MTC, and mold.

The West Bond 7614 is a wire bonder in the Packaging & Bonding category.

The Sumitomo SV 18 is a vertical injection molding machine described with picker machine, auto-gate cutting, conveyor, and MTC.

The West Bond 7443A is listed as a wire bonder.

The K&S Maxum Plus is a wire bonder manufactured by K&S.

The West Bond 3436E-90 is a large area wire bonder.

The Kulicke & Soffa 4124 Ball is a ball wire bonder for semiconductor packaging and bonding applications.

The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.

The West Bond 7KF Series is a manual wire bonder line for microelectronics packaging, and West Bond says it has designed and manufactured its wire bonding and die attach equipment since 1966.

The Nordson Asymtek X 1020 is a fluid dispenser with jet, needle, or spray dispensing technology.

The Palomar 3880-II is a highly flexible automated die bonder for R&D through volume production.

The EV Group EV 501 is a wafer bonder that performs anodic bonding, used to seal Pyrex wafers to silicon microfluidic channels.

The Sumitomo SE 130 DU CI is an injection molding machine.

The SUSS SB 6 is a 6-inch wafer bonder with thermal compression and anodic bonding capabilities.

The Besi / Datacon Fico MMS X is a molding machine used in semiconductor packaging and bonding.

The Palomar 3500-R is a factory refurbished die bonder with a bonder performance upgrade, a Cognex vision system, and an 8-position tool turret.

The Kulicke & Soffa Rapid is a wire bonder.

The West Bond 7327A is a thermocompression wedge manual wire bonder.

West-Bond 7400A is a manual wedge wire bonder line that includes vertical-feed and ultrasonic feed configurations.

The Shinkawa UTC 3000 is a wire bonder used in semiconductor packaging and bonding applications.

The K&S WB Max Ultra is a wire bonder used in semiconductor packaging and bonding.

The SUSS XBS300 W2W is a wafer bonding system for permanent and temporary bonding applications.

The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.

The Shinkawa SBB 1410 is a stud bump bonder produced by Shinkawa for semiconductor packaging and bonding applications.

The MRSI 505 is an ultra-precision, vision-guided, fully automatic, high-speed robotic assembly work cell used for semiconductor pick-and-place and bonding applications.

The SUSS XBS200 is a permanent bonding system from SUSS MicroTec.

The SUSS MicroTec ABC 200 is an automated production wafer bonder for semiconductor manufacturing. The SUSS MicroTec ABC 200 handles 8-inch wafers.

The K&S Rapid Automatic Wire Bonder is an automatic wire bonding system that operates on single-phase 50/60 Hz power.

The Nordson / Dage 4000 TPAXY is an automated bond-testing system.

The Besi Esec 2100 FC is a flip chip die bonder capable of 8 µm placement accuracy and up to 16,000 UPH.

The Nordson / Dage BT 4000 W is a manually loaded bond tester equipped with a DAGE SE MS0158 special image capture camera, a BS250-R cartridge, and a calibration jig and weights.

The West Bond 7700B is a ball bonder.