Comparison ledger
Signatone CM 210, Tenney , TPS JR-A-F4T Junior compact temperature test chambers, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | CM 210Signatone | |
|---|---|---|
| OEM | Signatone | Tenney |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Signatone CM 210 | Tenney , TPS JR-A-F4T Junior compact temperature test chambers |
| Specifications | ||
| Chuck XY Stage Travel Range | 205 mm x 205 mm (8.07 x 8.07 in)[1] | — |
| Chuck XY Travel Resolution (Standard) | 14 μm Per Degree of Knob Rotation[1] | — |
| Chuck XY Travel Resolution (Fine) | 1.5 μm Per Degree of Knob Rotation[1] | — |
| Chuck Z Stage Travel Range | 2.5 mm (0.01 in)[1] | — |
| Chuck Z Stage Repeatability | ± 1.0 μm[1] | — |
| Chuck Theta Stage Travel Range | ± 11° (22°)[1] | — |
| Chuck Theta Stage Accuracy | < 1.0 μm (measured at the edge of the 200 mm chuck)[1] | — |
| Probe Platen Material | Nickel Plated Steel (Aluminum optional)[1] | — |
| Probe Platen Dimensions | L = 580mm x W = 637mm x H = 12.7mm[1] | — |
| Max Number of Micro Positioners | 10x DC/HV or 2x RF + 4x DC or 4x RF + 2x DC or 2x CAP + 4x DC[1] | — |
| Contact Repeatability | < 1 μm (0.04 mils) by Manual Control[1] | — |
| Standard Wafer Chuck Diameter | 203 mm[1] | — |
| Standard Wafer Chuck Surface Planarity | ±6.5 μm[1] | — |
| Standard Wafer Chuck Rigidity | <3 μm / 10N at edge of the chuck[1] | — |
| Coax Chuck Operation Voltage | -200V to +200V DC[1] | — |
| Coax Chuck Max Voltage (Chuck to GND) | 500 V DC[1] | — |
| Coax Chuck Isolation | > 150 GΩ[1] | — |
| Triax Chuck Isolation (Force to Guard @ 10V) | > 2 TΩ[1] | — |
| System Dimensions (Optional Table) | 660 x 889 x 610 mm (26 x 35 x 24 in)[2] | — |
| System Weight (Optional Table) | 109 kg (240 lbs)[2] | — |
| System Dimensions Including Table | 863 x 1085 x 1370 mm (34 x 42.7 x 53.95 in)[2] | — |
| System Weight Including Table | 385 kg (849 lbs)[2] | — |
| Available Thermal Chuck Options | Standard Hot (25°C to 300°C), Hot/Triax (25°C to 200°C), Hot/3kV Triax (25°C to 200°C)[1] | — |
| Model | CM 210[3] | JR-A-F4T[4] |
| Type | Probe station[3] | — |
| Wafer size | 200 mm[1] | — |
| Probe station mode | Manual[1] | — |
| Wafer probing | Full or partial wafer probing[1] | — |
| Applications | DC, CV/IV, pulsed-IV, high power, RF[1] | — |
| RF frequency | Up to 110 GHz[1] | — |
| RF setup | 2 & 4 port setup[1] | — |
| High power application | Up to 12 kV / 600 A[1] | — |
| Chuck XY stage travel | 205 mm x 205 mm[1] | — |
| Chuck Z stage travel | 2.5 mm[1] | — |
| Chuck theta travel | ±11° (22°)[1] | — |
| Standard wafer chuck connectivity | Coax BNC (m)[1] | — |
| Triaxial wafer chuck connectivity | Triax (m)[1] | — |
| Standard wafer chuck material | Nickel plated brass (gold optional)[1] | — |
| Triaxial wafer chuck material | Gold plated brass[1] | — |
| Standard wafer chuck supported DUT sizes | 25 mm, 75 mm, 100 mm, 150 mm, 200 mm[1] | — |
| Triaxial wafer chuck supported DUT sizes | 3 mm, 75 mm, 125 mm, 200 mm[1] | — |
| Triaxial wafer chuck surface planarity | ±5 µm[1] | — |
| Chuck to thermal shield separation | Minimum 2 mm[1] | — |
| Contact repeatability | < 1 µm[1] | — |
| Temperature range, standard hot chuck | +25 °C to +300 °C[1] | — |
| Temperature range, hot triax chuck | +25 °C to +200 °C[1] | — |
| Temperature range, hot 3 kV triax chuck | +25 °C to +200 °C[1] | — |
| Temperature control method | Liquid cooled / resistance heater[1] | — |
| Temperature stability | ±0.1 °C[1] | — |
| Temperature accuracy | ±0.5 °C[1] | — |
| System controller model | S-1080, TC-II, 2XRC-89HL[1] | — |
| System dimensions including table | 863 x 1085 x 1370 mm[1] | — |
| System weight including table | 385 kg[1] | — |
| Standard warranty | 12 months[1] | — |
| Chamber Size | — | 1.2 cubic feet[4] |
| Temperature Range | — | -68°C to +180°C[4] |
| Control | — | +/-1.0°C[4] |
| Manufacturer | — | Tenney[4] |
| Short description | — | Junior compact temperature test chambers[4] |
| Control accuracy | — | +/-1.0°C[4] |
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