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Signatone

CM 210

Test & ProbeSignatone CM 210 family
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Signatone CM-210 is a 200mm high precision manual probe system. The CM-210 supports DC, CV/IV, pulsed-IV measurements, high power applications up to 12kV/600A, and RF applications up to 110GHz with 2 and 4 port setups.[1]

SignatoneCM 210
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Power

-200V to +200V DC[1]

Performance

< 1 μm (0.04 mils) by Manual Control[1]

What it is

General reference — not yet source-verified

A probe station is bench test equipment used to make temporary electrical contact to pads or other access points on a wafer or die. A manual probe station uses operator-controlled stage motion, microscope observation, and micropositioned probes to place contacts on the device under test for measurement and characterization. Probe stations are commonly used outside the main production line for device development, failure analysis, process characterization, and electrical verification.

How it works

The Signatone CM 210 uses a manual chuck XY stage with 205 mm x 205 mm travel. The Signatone CM 210 provides standard travel resolution of 14 μm per degree of knob rotation and fine travel resolution of 1.5 μm per degree of knob rotation. The Signatone CM 210 uses a precision leadscrew, carriage, and rails for chuck XY motion. The Signatone CM 210 uses a pneumatic chuck Z stage with 2.5 mm travel and ±1.0 μm repeatability. The Signatone CM 210 includes a manual theta stage with ±11° travel, accuracy below 1.0 μm measured at the edge of the 200 mm chuck, and repeatability below 1.5 μm. The Signatone CM 210 includes continuous platen lift for probe and DUT exchange and fine platen lift with a lock for setup.[1][2]

The Signatone CM 210 has a manual linear microscope stage with 50 mm x 50 mm movement range, resolution below 2 μm, and 101 mm scope lift. The Signatone CM 210 has a 50 mm thick aluminum base. The Signatone CM 210 has a probe platen with dimensions of 580 mm by 637 mm by 12.7 mm. The Signatone CM 210 supports up to 10 DC or HV micropositioners, or mixed RF and DC configurations that include 2 RF plus 4 DC, 4 RF plus 2 DC, or 2 CAP plus 4 DC. The Signatone CM 210 can be upgraded to motorized joystick control or semi-automatic step-and-repeat control. The Signatone CM 210 can also be equipped with an optional roll-out loading stage, active vibration isolation table, and optional hot chuck system.[1][2][8]

Where it fits in the process flow

General reference — not yet source-verified

Probe stations are generally used after wafers or test structures have been fabricated and made accessible for electrical contact. Probe-station work commonly follows front-end or back-end process steps that create active devices, interconnect, and contact pads. Probe-station results often feed engineering decisions on process tuning, device behavior, reliability study, and readiness for later package-level evaluation.

What do the numbers mean?

Power & electrical7

Max Number of Micro Positioners
10x DC/HV or 2x RF + 4x DC or 4x RF + 2x DC or 2x CAP + 4x DC[1]
Accurate?
Coax Chuck Operation Voltage
-200V to +200V DC[1]
Accurate?
Coax Chuck Max Voltage (Chuck to GND)
500 V DC[1]
Accurate?
Triax Chuck Isolation (Force to Guard @ 10V)
> 2 TΩ[1]
Accurate?
Applications
DC, CV/IV, pulsed-IV, high power, RF[1]
Accurate?
RF frequency
Up to 110 GHz[1]
Accurate?
RF setup
2 & 4 port setup[1]
Accurate?

Wafer handling28

Chuck XY Stage Travel Range
205 mm x 205 mm (8.07 x 8.07 in)[1]
Accurate?
Chuck XY Travel Resolution (Standard)
14 μm Per Degree of Knob Rotation[1]
Accurate?
Chuck XY Travel Resolution (Fine)
1.5 μm Per Degree of Knob Rotation[1]
Accurate?
Chuck Z Stage Travel Range
2.5 mm (0.01 in)[1]
Accurate?
Chuck Z Stage Repeatability
± 1.0 μm[1]
Accurate?
Chuck Theta Stage Travel Range
± 11° (22°)[1]
Accurate?
Chuck Theta Stage Accuracy
< 1.0 μm (measured at the edge of the 200 mm chuck)[1]
Accurate?
Standard Wafer Chuck Diameter
203 mm[1]
Accurate?
Standard Wafer Chuck Surface Planarity
±6.5 μm[1]
Accurate?
Standard Wafer Chuck Rigidity
<3 μm / 10N at edge of the chuck[1]
Accurate?
Coax Chuck Isolation
> 150 GΩ[1]
Accurate?
Available Thermal Chuck Options
Standard Hot (25°C to 300°C), Hot/Triax (25°C to 200°C), Hot/3kV Triax (25°C to 200°C)[1]
Accurate?
Wafer size
200 mm[1]
Accurate?
Wafer probing
Full or partial wafer probing[1]
Accurate?
Chuck XY stage travel
205 mm x 205 mm[1]
Accurate?
Chuck Z stage travel
2.5 mm[1]
Accurate?
Chuck theta travel
±11° (22°)[1]
Accurate?
Standard wafer chuck connectivity
Coax BNC (m)[1]
Accurate?
Triaxial wafer chuck connectivity
Triax (m)[1]
Accurate?
Standard wafer chuck material
Nickel plated brass (gold optional)[1]
Accurate?
Triaxial wafer chuck material
Gold plated brass[1]
Accurate?
Standard wafer chuck supported DUT sizes
25 mm, 75 mm, 100 mm, 150 mm, 200 mm[1]
Accurate?
Triaxial wafer chuck supported DUT sizes
3 mm, 75 mm, 125 mm, 200 mm[1]
Accurate?
Triaxial wafer chuck surface planarity
±5 µm[1]
Accurate?
Chuck to thermal shield separation
Minimum 2 mm[1]
Accurate?
Temperature range, standard hot chuck
+25 °C to +300 °C[1]
Accurate?
Temperature range, hot triax chuck
+25 °C to +200 °C[1]
Accurate?
Temperature range, hot 3 kV triax chuck
+25 °C to +200 °C[1]
Accurate?

Performance3

Contact Repeatability
< 1 μm (0.04 mils) by Manual Control[1]
Accurate?
Contact repeatability
< 1 µm[1]
Accurate?
Temperature accuracy
±0.5 °C[1]
Accurate?

Control & software2

Temperature control method
Liquid cooled / resistance heater[1]
Accurate?
System controller model
S-1080, TC-II, 2XRC-89HL[1]
Accurate?

Dimensions & facilities7

Probe Platen Dimensions
L = 580mm x W = 637mm x H = 12.7mm[1]
Accurate?
System Dimensions (Optional Table)
660 x 889 x 610 mm (26 x 35 x 24 in)[2]
Accurate?
System Weight (Optional Table)
109 kg (240 lbs)[2]
Accurate?
System Dimensions Including Table
863 x 1085 x 1370 mm (34 x 42.7 x 53.95 in)[2]
Accurate?
System Weight Including Table
385 kg (849 lbs)[2]
Accurate?
System dimensions including table
863 x 1085 x 1370 mm[1]
Accurate?
System weight including table
385 kg[1]
Accurate?

Configuration & options7

Probe Platen Material
Nickel Plated Steel (Aluminum optional)[1]
Accurate?
Model
CM 210[3]
Accurate?
Type
Probe station[3]
Accurate?
Probe station mode
Manual[1]
Accurate?
High power application
Up to 12 kV / 600 A[1]
Accurate?
Temperature stability
±0.1 °C[1]
Accurate?
Standard warranty
12 months[1]
Accurate?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Max Number of Micro Positioners10x DC/HV or 2x RF + 4x DC or 4x RF + 2x DC or 2x CAP + 4x DC[1]
  • Coax Chuck Operation Voltage-200V to +200V DC[1]
  • Coax Chuck Max Voltage (Chuck to GND)500 V DC[1]
  • Triax Chuck Isolation (Force to Guard @ 10V)> 2 TΩ[1]
  • ApplicationsDC, CV/IV, pulsed-IV, high power, RF[1]
  • RF frequencyUp to 110 GHz[1]
  • RF setup2 & 4 port setup[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What wafer size is the Signatone CM 210 built for?

The Signatone CM 210 is a 200 mm manual probe station.[1][2][8]

What measurement types does the Signatone CM 210 support?

The Signatone CM 210 is intended for DC, CV/IV, pulsed-IV, high-power, and RF test measurements.[1][2][8]

What are the main manual stage motions on the Signatone CM 210?

The Signatone CM 210 has a manual chuck XY stage with 205 mm x 205 mm travel, a pneumatic chuck Z stage with 2.5 mm travel, and a manual theta stage with ±11° travel.[1][2]

Can the Signatone CM 210 be configured for RF probing?

The Signatone CM 210 is specified for RF applications up to 110 GHz with 2-port and 4-port setup. The Signatone CM 210 also supports mixed micropositioner configurations that include 2 RF plus 4 DC or 4 RF plus 2 DC.[1][2]

Not publicly documented

The following facts about the CM 210 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CM 210 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the CM 210 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the CM 210 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the CM 210 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the CM 210 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (8)Every fact above is drawn from these public sources
  1. [1]signatone.com — signatone.comsignatone.com
  2. [2]microworld.eu — microworld.eumicroworld.eu
  3. [3]Equipment inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]en.wikipedia.orgen.wikipedia.org
  6. [6]waferpedia.comwaferpedia.com
  7. [7]waferpedia.comwaferpedia.com
  8. [8]Signatone CM-210 Checkmate 200mm high precision manual Probe Station | HMC Sales & Service | Semiconductor Equipment Distributor Singapore — hmcasia.comhmcasia.com
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Last updated Oct 17, 2026.

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