Comparison ledger
SPTS CET25 and SPTS MACS ICP, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | CET25SPTS | MACS ICPSPTS |
|---|---|---|
| OEM | SPTS | SPTS |
| Category | Etch | Etch |
| Wafer size | 25-wafer batch | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SPTS CET25 | SPTS MACS ICP |
| Specifications | ||
| Process type | HF vapor release etch for MEMS[1] | — |
| Batch size | 25-wafer batch[1] | — |
| Target application | Medium to high volume production applications[1] | — |
| Key benefits | High throughput; process chamber, gas and liquid panel, and pressure control components within a small footprint; extensive process control and monitoring functions[1] | — |
| Configuration support | Various SPTS cluster configurations with the ability to support multiple process modules[1] | — |
| Configuration | — | HR chamber[2] |
| Clamp type | — | standard WTC[2] |
| Coil RF power | — | Advanced Energy RFG3001, 3kw[2] |
| Platen RF power | — | ENI ACG-3B 13.56MHZ, 300w[2] |
| Load lock pump | — | Ebara AAL10[2] |
| Chamber pump | — | Ebara A30W[2] |
| Turbo pump | — | Leybold MAG2000CT[2] |
| Turbo Pump Controller | — | Leybold MAG Drive 2000[2] |
| Chiller | — | ATS/DEX-20ADI[2] |
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