Comparison ledger
SPTS CET25 and SPTS RIE-10, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | CET25SPTS | RIE-10SPTS |
|---|---|---|
| OEM | SPTS | SPTS |
| Category | Etch | Etch |
| Wafer size | 25-wafer batch | 6-inch wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SPTS CET25 | SPTS RIE-10 |
| Specifications | ||
| Process type | HF vapor release etch for MEMS[1] | — |
| Batch size | 25-wafer batch[1] | — |
| Target application | Medium to high volume production applications[1] | — |
| Key benefits | High throughput; process chamber, gas and liquid panel, and pressure control components within a small footprint; extensive process control and monitoring functions[1] | — |
| Configuration support | Various SPTS cluster configurations with the ability to support multiple process modules[1] | — |
| Etch rate | — | 6–10 µm/min[2] |
| Aspect ratio | — | 50:1[2] |
| Selectivity to resist | — | >50:1[2] |
| Selectivity to silicon oxide | — | >100:1[2] |
| Uniformity | — | <5% across 6-inch wafers[2] |
| Primary RF power | — | up to 3,000 W[2] |
| Secondary RF power | — | up to 3,000 W[2] |
| Substrate power | — | up to 300 W[2] |
| Chuck temperature range | — | -15°C to +40°C[2] |
| Sample size handling | — | 6-inch or smaller samples[2] |
| End point detector | — | Claritas End Point Detector[2] |
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