Comparison ledger
SUSS MicroTec ABC 200, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ABC 200SUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ABC 200 | West Bond 10490 |
| Specifications | ||
| Manufacturer | SUSS MicroTec[1] | West Bond[4] |
| Model | ABC 200[2] | 10490[4] |
| Equipment type | Automated Production Wafer Bonder[3] | — |
| Category | Packaging & Bonding[3] | — |
| Wafer size | 8 inch[1] | — |
| Description | — | Convertible bonder, wedge to ball[5] |
| Tool type | — | Convertible bonder[6] |
| Bonding modes | — | Wedge bonding and ball bonding[6] |
| Use | — | Wire bonding[6] |
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