ABC 200

The SUSS MicroTec ABC 200 is an automated production wafer bonder. The SUSS MicroTec ABC 200 is used for bonding wafers in semiconductor manufacturing. The SUSS MicroTec ABC 200 is in the Packaging & Bonding equipment category. The SUSS MicroTec ABC 200 handles 8-inch wafers.^[3][1][2]

Wafer bonders bring wafers into alignment and then apply bonding conditions that join the surfaces into a permanent stack or pair. Wafer bonders are used when device fabrication or packaging requires two wafers to be combined into a single bonded structure. Automated production wafer bonders generally integrate wafer handling, alignment, bonding, and cycle control into one tool.

Wafer bonding tools are used after the wafers that will be joined have already been prepared by prior fabrication, deposition, patterning, cleaning, or surface-conditioning steps. Wafer bonding sits in a packaging or integration flow where the bonded pair is then transferred to follow-on steps such as thinning, singulation, interconnect formation, or further assembly, depending on the device scheme.

Wafer bonders are used for semiconductor manufacturing processes that require one wafer to be attached to another wafer. Wafer bonding supports applications such as substrate transfer, temporary carrier attachment, permanent wafer stacking, and package or device structures that depend on bonded wafer assemblies.