Comparison ledger
SUSS MicroTec FC150, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | FC150SUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec FC150 | West Bond 10490 |
| Specifications | ||
| Equipment type | device bonder[1] | — |
| Use in source | used in the imprint process[1] | — |
| Use | used in the imprint process[1] | Wire bonding[6] |
| Process | Step & Stamp process to imprint structures[2] | — |
| Application | imprinting sub-micron structures in inherently conductive polyaniline[2] | — |
| Tool type | flip-chip bonder[3] | Convertible bonder[6] |
| Chip-to-chip application size | up to 100 mm[3] | — |
| Chip-to-wafer application size | up to 200 mm[3] | — |
| Accuracy | ± 1 μm[3] | — |
| Manufacturer | — | West Bond[4] |
| Model | — | 10490[4] |
| Description | — | Convertible bonder, wedge to ball[5] |
| Bonding modes | — | Wedge bonding and ball bonding[6] |
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