SUSS MicroTec
FC150
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedA device bonder is packaging and bonding equipment used to align parts and join them under controlled process conditions. Device bonders are used after device fabrication when chips, wafers, caps, or other substrates must be assembled into a combined structure.
How it works
The SUSS MicroTec FC150 was used in a Step & Stamp process to imprint structures into an inherently conductive PANI-dodecylbenzenesulfonic acid toluene solution on a PET substrate. The described experiments were performed at room temperature with pressure and time as variables. The described printed-structure depth increased linearly with pressure when printing time was 5 minutes or longer.[1][2]
Applications
The SUSS MicroTec FC150 was used for imprinting sub-micron structures in inherently conductive polyaniline. The described material system was PANI-dodecylbenzenesulfonic acid in toluene on PET.[1][2]
- step and stamp imprint lithography
What do the numbers mean?
Wafer handling1
Performance1
Configuration & options7
Parts & consumables
Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of equipment is the SUSS MicroTec FC150?
What process is the SUSS MicroTec FC150 used for in the described example?
The SUSS MicroTec FC150 was used in a Step & Stamp process to imprint structures.[1][2]
Not publicly documented
The following facts about the FC150 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC150 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FC150 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FC150 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC150 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FC150 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]proxy.siteo.com.s3.amazonaws.comproxy.siteo.com.s3.amazonaws.com
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]Equipment inventory listing
- [7]SUSS MicroTec FC150 family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 19, 2026.
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