SUSS MicroTec
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS MicroTec FC150 is a device bonder used in imprint processing.[1]
In the described use, the FC150 is used in a Step & Stamp process to imprint structures into an inherently conductive PANI-dodecylbenzenesulfonic acid (PANI-DBSA) toluene solution on a PET substrate.[1]
The experiments are performed at room temperature, with pressure and time as variables. The depth of the printed structures increases linearly with pressure when printing time is 5 minutes or longer.[1]
The FC150 appears in a wafer-level imprint process. The described work uses a spincoated film on a PET substrate before imprinting.[1]
The FC150 is used for imprinting sub-micron structures in inherently conductive polyaniline. The described material system is PANI-DBSA in toluene on PET.[1]
Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
It is used in a Step & Stamp process to imprint structures.[1]
The patterned material is an inherently conductive PANI-dodecylbenzenesulfonic acid (PANI-DBSA) toluene solution.[1]
The experiments are performed at room temperature, with pressure and time as variables.[1]
The following facts about the FC150 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the FC150 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC150 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FC150 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FC150 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC150 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Last updated Jul 29, 2026.
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.