Waferpedia

Comparison ledger

MA100 / 150e Gen2versusMA6-BA6

SUSS MicroTec MA100 / 150e Gen2, SUSS MicroTec MA6-BA6, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MA100 / 150e Gen2SUSS MicroTec
MA6-BA6SUSS MicroTec
OEMSUSS MicroTecSUSS MicroTec
CategoryLithographyLithography
Wafer size150mm150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
GenerationGen2—
FamilySUSS MicroTec MA100 / 150e Gen2SUSS MicroTec MA6-BA6
Cited variants—
Specifications
TypeAutomated system[2]—
Wafer sizeup to 150 mm[2]—
FunctionMask Alignment, Exposure[2]—
System name—JBX 6300FS[3]
Tool type—advanced direct write ebeam lithography system[3]
Wafer capacity—up to 150mm wafers[3]
Feature size capability—sub-10 nm features[3]
Optical configuration—a fifth lens can be used to get a smaller beam spot size[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]lab.kni.caltech.edulab.kni.caltech.edu
  2. [2]hilpert.chhilpert.ch
  3. [3]cnf.cornell.educnf.cornell.edu