SUSS MicroTec
Plate 01Suss MA6/BA6 Mask Aligner (ID# 4923)
Wafer size
150mm
Optics
sub-10 nm features[1]
Process applications and technology nodes documented for this tool.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MA6/BA6 | — | — | Configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder. | lab.kni.caltech.edu[2] |
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The following facts about the MA6-BA6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA6-BA6 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MA6-BA6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA6-BA6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA6-BA6 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MA6-BA6 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Jul 29, 2026.
The GCA 6300 DSW is a g-line wafer stepper used for lithography, with source descriptions also identifying related i-line GCA 6300 stepper documentation.