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SUSS MicroTec

MA6-BA6

Lithography150mmSUSS MicroTec MA6-BA6 family
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The SUSS MicroTec MA6-BA6 is a contact mask aligner for lithography. The SUSS MicroTec MA6-BA6 supports front-side alignment, back-side alignment, and flood exposure. The SUSS MicroTec MA6-BA6 can create structures as small as 500 nm on sample sizes up to 6 inches.[1]

SUSS MicroTec logo
Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)
  • Plate 01Suss MA6/BA6 Mask Aligner (ID# 4923)

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Wafer size

150mm

Vacuum

1 - 0.5 um[1]

Optics

sub-10 nm features[2]

What it is

The SUSS MicroTec MA6-BA6 is a contact mask aligner used for lithography. The MA6-BA6 enables frontside alignment, backside alignment, and flood exposure. The MA6-BA6 creates structures as small as 500 nm on sample sizes up to 6 inches.[1]

Where it fits in the process flow

General reference — not yet source-verified

Mask aligners sit in the photolithography portion of a process flow after substrate preparation and resist coating, and before development, pattern transfer, or lift-off. In typical use, the patterned resist produced by the aligner serves as the temporary stencil for later etch, deposition, implant, or metallization steps.

Applications

The MA6-BA6 supports front side flood exposure without a mask, front side alignment and exposure, and back side alignment with front side exposure. The MA6-BA6 is used for front- and back-side aligned lithography on substrates up to 6 inches.[1]

  • direct-write applications
  • mask fabrication

What do the numbers mean?

Vacuum & pumping2

Exposure resolution, soft vacuum contact mode
1 - 0.5 um[1]
Accurate?
Exposure resolution, vacuum contact mode
0.4 - 0.5 um[1]
Accurate?

Wafer handling2

Wafer capacity
up to 150mm wafers[2]
Accurate?
Wafer size
Whole wafers 2" up to 6" can be loaded[1]
Accurate?

Optics & imaging7

Feature size capability
sub-10 nm features[2]
Accurate?
Optical configuration
a fifth lens can be used to get a smaller beam spot size[2]
Accurate?
Techniques
Frontside Alignment, Backside Alignment, Flood exposure[1]
Accurate?
Exposure resolution, soft contact mode
1 - 2 um[1]
Accurate?
Exposure resolution, hard contact mode
1 um[1]
Accurate?
Channel 1 wavelength
365nm[1]
Accurate?
Channel 2 wavelength
405nm[1]
Accurate?

Configuration & options9

System name
JBX 6300FS[2]
Accurate?
Tool type
advanced direct write ebeam lithography system[2]
Accurate?
Manufacturer
SUSS MicroTec[1]
Accurate?
Model
MA6 & MA6/BA6[1]
Accurate?
Instrument type
Lithography[1]
Accurate?
Sample capacity
Samples pieces up to 6"x6" square can be loaded[1]
Accurate?
Sample thickness
Samples up to 6mm thick can be loaded[1]
Accurate?
Channel 1 irradiance
15 mW/cm2[1]
Accurate?
Channel 2 irradiance
25 mW/cm2[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
MA6/BA6——Configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder.lab.kni.caltech.edu[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Exposure resolution, soft vacuum contact mode1 - 0.5 um[1]
  • Exposure resolution, vacuum contact mode0.4 - 0.5 um[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What substrate sizes can the MA6-BA6 load?

The MA6-BA6 can load whole wafers from 2 inches up to 6 inches. The MA6-BA6 can also load sample pieces up to 6 inch by 6 inch square.[1]

What sample thickness can the MA6-BA6 accept?

The MA6-BA6 can load samples up to 6 mm thick.[1]

Not publicly documented

The following facts about the MA6-BA6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA6-BA6 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the MA6-BA6 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MA6-BA6 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MA6-BA6 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the MA6-BA6 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]lab.kni.caltech.edu — lab.kni.caltech.edulab.kni.caltech.edu
  2. [2]cnf.cornell.edu — cnf.cornell.educnf.cornell.edu
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Last updated Oct 17, 2026.

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