Comparison ledger
Tegal 110, Tegal 900ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | 900ACSTegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | — | 75mm to 200mm wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | Legacy |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 110 | Tegal 900ACS |
| Cited variants |
|
|
| Specifications | ||
| model | 110 SE[1] | — |
| application focus | process development applications[1] | — |
| process capability | deep silicon plasma etching[1] | — |
| capabilities | very high aspect ratio trench etch and profile control[1] | — |
| configuration | multiple configurations with minimum technical intervention[1] | — |
| System type | plasma etch system[3] | — |
| Supported components | MEMS and 3D-IC components[1] | — |
| Control capability | very high aspect ratio trench etch and profile control[3] | — |
| Physical description | compact[1] | — |
| tool type | — | single wafer cassette-to-cassette etch system[2] |
| process type | — | non-critical plasma etch[2] |
| wafer range | — | 75mm to 200mm wafers[2] |
| series | — | ACS series[2] |
| features | — | faster throughput, faster system calibration, touchscreen graphical user interface, integrated data logging, and factory automation support[2] |
| throughput | — | faster throughput[2] |
| system calibration | — | faster system calibration[2] |
| user interface | — | touchscreen graphical user interface[2] |
| data logging | — | integrated data logging[2] |
| automation support | — | factory automation support[2] |
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