Comparison ledger
Tegal 110, Tokyo Electron TACVESNV Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | TACVESNV DryTokyo Electron |
|---|---|---|
| OEM | Tegal | Tokyo Electron |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 110 | Tokyo Electron TACVESNV Dry |
| Cited variants |
| — |
| Specifications | ||
| model | 110 SE[1] | — |
| application focus | process development applications[1] | — |
| process capability | deep silicon plasma etching[1] | — |
| capabilities | very high aspect ratio trench etch and profile control[1] | — |
| configuration | multiple configurations with minimum technical intervention[1] | — |
| System type | plasma etch system[2] | — |
| Supported components | MEMS and 3D-IC components[1] | — |
| Control capability | very high aspect ratio trench etch and profile control[2] | — |
| Physical description | compact[1] | — |
| Asset Number | — | 73365[3] |
| Last Confirm Date | — | August 22, 2023[3] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →