Waferpedia

Comparison ledger

110versusUnity ME 8555 SSS Dry

Tegal 110, Tokyo Electron Unity ME 8555 SSS Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
110Tegal
Unity ME 8555 SSS DryTokyo Electron
OEMTegalTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 110Tokyo Electron Unity
Cited variants—
Specifications
model110 SE[1]—
application focusprocess development applications[1]—
process capabilitydeep silicon plasma etching[1]—
capabilitiesvery high aspect ratio trench etch and profile control[1]—
configurationmultiple configurations with minimum technical intervention[1]—
System typeplasma etch system[2]—
Supported componentsMEMS and 3D-IC components[1]—
Control capabilityvery high aspect ratio trench etch and profile control[2]—
Physical descriptioncompact[1]—
Configuration—3 Ch Oxide[3]
Manufacturer—Tokyo Electron[4]
Model—Unity ME 8555 SSS[4]
Tool type—Dry Etcher[4]
Wafer size—8 inch[3]
Software version—1.00[3]
Condition note—Missing parts[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com