Comparison ledger
Tegal 110, Trion Apollo, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | ApolloTrion |
|---|---|---|
| OEM | Tegal | Trion |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 110 | Trion Apollo |
| Cited variants |
| — |
| Specifications | ||
| model | 110 SE[1] | — |
| application focus | process development applications[1] | — |
| process capability | deep silicon plasma etching[1] | — |
| capabilities | very high aspect ratio trench etch and profile control[1] | — |
| configuration | multiple configurations with minimum technical intervention[1] | — |
| System type | plasma etch system[2] | — |
| Supported components | MEMS and 3D-IC components[1] | — |
| Control capability | very high aspect ratio trench etch and profile control[2] | — |
| Physical description | compact[1] | — |
| Wafer size | — | 100mm to 300mm[3] |
| Etch rate (photoresist strip) | — | up to 6 µm/min[3] |
| Plasma source options | — | Inductively Coupled Plasma (ICP) or SST-Lightning microwave[4] |
| RF bias | — | Yes (RIE biased electrode)[5] |
| Tuning | — | Self-tuning / automatic tuning[3] |
| Chuck type | — | Electrostatic chuck with helium backside cooling[5] |
| Wafer handling robot | — | Multi-axis atmospheric robot; transports 150mm, 200mm, and 300mm wafers[5] |
| Process controller | — | PC-based with graphical software; recipes stored on 3.5" disks[5] |
| Physical dimensions (W x D x H) | — | 18" x 50" x 51"[5] |
| Maximum wafer size (stated in source) | — | up to 8" (200mm) — note: source also states robot handles 300mm wafers[5] |
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