Comparison ledger
Tegal 110, Ulvac NE 5700, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | NE 5700Ulvac |
|---|---|---|
| OEM | Tegal | Ulvac |
| Category | Etch | Etch |
| Wafer size | — | Wafer Equipment |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 110 | Ulvac NE-5700 |
| Cited variants |
| — |
| Specifications | ||
| model | 110 SE[1] | — |
| application focus | process development applications[1] | — |
| process capability | deep silicon plasma etching[1] | — |
| capabilities | very high aspect ratio trench etch and profile control[1] | — |
| configuration | multiple configurations with minimum technical intervention[1] | — |
| System type | plasma etch system[2] | — |
| Supported components | MEMS and 3D-IC components[1] | — |
| Control capability | very high aspect ratio trench etch and profile control[2] | — |
| Physical description | compact[1] | — |
| Wafer size | — | Wafer Equipment[3] |
| Wafer Size | — | 150mm[3] |
| Category | — | Etch[3] |
| Process | — | Metal Etcher[3] |
| Equipment | — | Dry Etcher[3] |
| Make | — | Ulvac[4] |
| Model | — | NE 5700[4] |
| Equipment type | — | Etcher[4] |
| Application | — | Dry etching system for production[5] |
| Cluster Configuration | — | Up to two process chambers[5] |
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