Waferpedia

Comparison ledger

1512eversusTE 8401 Dry

Tegal 1512e, Tokyo Electron TE 8401 Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
TE 8401 DryTokyo Electron
OEMTegalTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 1512eTokyo Electron TE 8401
Cited variants—
  • Single chamber poly etch[1]
  • Dual chamber nitride etch[2]
  • TE 8401 (poly etch configuration)[1]
  • TE 8401 (nitride etch configuration)[2]
Specifications
Tool typeIndustrial RIE plasma etcher system[3]—
Stated configurationWith modules assembly for CI-4222[3]—
Configuration—Single chamber[1]
Gas—He, O2, CF4, HBr, CL2[1]
OS—EPROM based system[1]
Missing—pumps[2]
Wafer Size—8 inch (200 mm)[4]
Chamber Configuration (Poly Etch)—Single chamber[1]
Chamber Configuration (Nitride Etch)—Dual chamber[2]
Process Gases (Poly Etch)—He, O2, CF4, HBr, Cl2[1]
Process Gases (Nitride Etch)—HBr, Cl2[2]
Operating System (Poly Etch)—EPROM based system[1]
Operating System (Nitride Etch)—JDOS[2]
Chamber Configuration—Single chamber[1]
Process Type—Poly etch[1]
Gases—He, O2, CF4, HBr, Cl2[1]
Operating System—EPROM based system[1]
Vintage—1996[5]
Type—Dry Etcher[4]
Process—Poly etch[1]
Chamber configuration—Dual chamber[2]
Operating system—EPROM based[1]
OEM—Tokyo Electron[4]
Model—TE 8401[4]
Category—Dry Etcher[4]
Control system—EPROM based system[1]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]Equipment inventory listing
  5. [5]Equipment inventory listing