Comparison ledger
Tenney , TPS JR-A-F4T Junior compact temperature test chambers, Veeco WaferStorm 3303 Automated Solvent Processor, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | Tenney | Veeco |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | Load port-TDK with wafer mapping and RFID reader |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tenney , TPS JR-A-F4T Junior compact temperature test chambers | Veeco Waferstorm |
| Specifications | ||
| Chamber Size | 1.2 cubic feet[1] | — |
| Temperature Range | -68°C to +180°C[1] | — |
| Control | +/-1.0°C[1] | — |
| Manufacturer | Tenney[1] | — |
| Model | JR-A-F4T[1] | WaferStorm 3303[2] |
| Short description | Junior compact temperature test chambers[1] | — |
| Control accuracy | +/-1.0°C[1] | — |
| Configuration | — | Single 300mm FOUP load port for high volume platform[2] |
| Wafer size | — | Load port-TDK with wafer mapping and RFID reader[2] |
| Station 1 | — | Solvent Immersion 200/300mm (Fill by NMP Fresh Supply)[2] |
| Load port | — | Single 300mm FOUP load port; load port-TDK with wafer mapping and RFID reader[2] |
| Wafer sizes | — | 200/300mm; 200-mm adapter plate allows 200mm cassette in place of 300mm FOUP[2] |
| Construction | — | Stainless steel with mirror finish[2] |
| User interface | — | PC-based user interface with local data storage[2] |
| Data storage | — | SOL-based database RAID drive for control system and data storage[2] |
| Host interface | — | SECS/GEM software for host interface[2] |
| Fire suppression | — | CO2 Fire suppression system for 90" frame; IR detector, 120-degree viewing angle and Linear Heat Detector Wire[2] |
| Power backup | — | UPS battery backup for PC[2] |
| Status light | — | 3-Color LED status light lower (red, yellow, green)[2] |
| Filtration | — | ULPA Filter with Air Ionizer bar (Standard ESD level l)[2] |
| Robotic wafer handler | — | Vertical, rotary, two paddle axes; additional paddle axis (2); vacuum paddles (4); wafer alignment with LED backlight, color camera, and PC image processing; handler cover drain[2] |
| Station 2 | — | MLO Spin Process chamber with grip actuator and spindle motor; Haler chamber with exhaust pressure, temperature and cover interlock sensors; CCD camera for chamber monitoring and video archive with LED lighting; spin chuck-200/300mm (Active Edge Grip, Stainless Steel)[2] |
| Dispense Arm 2 | — | Dual-position feedback; Dispense A: LPD stream (NMP Fresh or Recirculated, Heated); Dispense B: HPC Fan-spray (NMP Recirculated, Heated); Dispense C: HPC Needle-spray (NMP Recirculated, Heated); continuous-duty 35:1 high-pressure pump and high-pressure filter; heater-SS 2-kW single path (Dispense A); heater-SS 2-kW dual path (Dispense B&C)[2] |
| Dispense Arm 3 | — | Dual-position feedback; Dispense A: LPD stream (NMP Recirculated, Heated); Dispense B: High-velocity spray (NMP Recirculated, Heated); shared heater-SS 3-kW, single path[2] |
| Wall-mounted dispenses | — | Stationary with adjustable nozzles; wall-dispense nozzle (NMP Recirculated or Fresh, Heated); shared heater-SS 3-kW, single path (Wall Dispense, Backside Rinse A&B)[2] |
| Backside dispenses | — | Adjustable nozzles; backside nozzle-A&B: LPD Stream (NMP Recirculated or Fresh, Heated)[2] |
| Chamber rinse | — | 6 nozzles (NMP Recirculated, Ambient)[2] |
| Drain diverter Station 2 | — | Teflon 3-way (NMP recirculation/Solvent drain)[2] |
| Station 3 | — | SRD Spin Process chamber with grip actuator and spindle motor; Haler chamber with exhaust pressure, temperature and cover interlock sensors; CCD camera with LED lighting; O2 monitoring system with high-flow N2 purge and O2 sensor integrated into the chamber exhaust[2] |
| Spin chuck Station 3 | — | 200/300mm (Active Edge Grip, Stainless Steel)[2] |
| Dispense Arm 2 Station 3 | — | Dual-position feedback; Dispense A: LPD stream (IPA Ambient); Dispense B: High-velocity spray (IPA Ambient)[2] |
| Dispense Arm 3 Station 3 | — | Dual-position feedback; Dispense A: LPD stream (DIW, Ambient)[2] |
| Dispense Arm 4 Station 3 | — | Dual-position feedback; N2 heated dispense with programmable 400-W heater, 0.003-µm filter[2] |
| Wall-mounted dispenses Station 3 | — | Stationary with adjustable nozzles; wall-dispense nozzle A: (IPA, Ambient); backside nozzles-A&B: (IPA, Ambient); chamber rinse--6 nozzles (IPA, Ambient); drain diverter Teflon 3-way (IPA drain/Industrial drain)[2] |
| Heater-SS 3-kW, single path | — | 6kW total heat (2)[2] |
| DFR solvent strainer | — | Triple-Stage with automatic flush feature[2] |
| Dispense A | — | LPD stream (NMP Fresh or Recirculated, Heated)[2] |
| Dispense B | — | HPC Fan-spray (NMP Recirculated, Heated)[2] |
| Dispense C | — | HPC Needle-spray (NMP Recirculated, Heated)[2] |
| Continuous-duty 35 | — | 1 high-pressure pump and high-pressure filter[2] |
| Wall-dispense nozzle | — | (NMP Recirculated or Fresh, Heated)[2] |
| Backside nozzle-A&B | — | LPD Stream (NMP Recirculated or Fresh, Heated)[2] |
| 02 Monitoring system | — | High-flow N2 purge with 02 sensor integrated into the chamber exhaust[2] |
| Wall-dispense nozzle A | — | (IPA, Ambient) Backside dispenses with adjustable nozzles Backside nozzles-A&B: (IPA, Ambient)[2] |
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