Veeco
WaferStorm 3303 Automated Solvent Processor
The Veeco WaferStorm 3303 is an automated solvent processor with a single 300mm FOUP load port for a high volume platform. The Veeco WaferStorm 3303 processes 200/300mm wafers through solvent immersion, MLO spin, and SRD spin-dry stations. The Veeco WaferStorm 3303 uses a PC-based user interface with local data storage and SECS/GEM software for host interface.[1]
Wafer size
Load port-TDK with wafer mapping and RFID reader
Power
6kW total heat (2)[1]
Vacuum
vacuum paddles (4)[1]
Gas delivery
Triple-Stage with automatic flush feature[1]
What it is
The Veeco WaferStorm 3303 Automated Solvent Processor is a semiconductor wafer-processing system. The WaferStorm 3303 uses a single 300 mm FOUP load port and supports a 200 mm adapter plate for a 200 mm cassette in place of a 300 mm FOUP.[1]
The WaferStorm 3303 includes a robotic wafer handler, a solvent immersion station, a multiple liquid operations spin process chamber, and an SRD spin process chamber. The system includes a PC-based user interface, local data storage, SECS/GEM host interface software, and wafer mapping with an RFID reader at the load port.[1]
How it works
The WaferStorm 3303 uses a vertical, rotary handler with paddle axes and vacuum paddles for wafer transfer and alignment. The system uses a wafer alignment setup with LED backlight, color camera, and PC image processing, together with chamber cameras and LED lighting for monitoring.[1]
The WaferStorm 3303 includes solvent immersion with agitation and recirculation, spin processing with multiple dispense paths, and SRD drying with nitrogen purge and monitored exhaust. The equipment also includes filters, heaters, cooling coils, drain diverters, and interlock sensors to control liquid handling and chamber operation.[1]
Applications
The WaferStorm 3303 is used for solvent-based wafer cleaning and drying. The listed stations support NMP immersion and dispense, IPA dispense, and DIW dispense for wet processing steps.[1]
The WaferStorm 3303 is configured for 200 mm and 300 mm wafer handling. The tool includes features for wafer alignment, chamber monitoring, host communication, and solvent recirculation during wet processing.[1]
What do the numbers mean?
Power & electrical6
- Solvent immersion station, SS construction with 2-kW heater and vertical agitation[1]
- Station 1
- Solvent Immersion 200/300mm (Fill by NMP Fresh Supply); SS construction with 2-kW heater and vertical agitation; recirculation While Knight pump with 9.0-µm and 0.1-µm filters; cooling coils; heater-SS 3-kW, single path; 6kW total heat (2); DFR solvent strainer triple-stage with automatic flush feature[1]
- Dispense Arm 2
- Dual-position feedback; Dispense A: LPD stream (NMP Fresh or Recirculated, Heated); Dispense B: HPC Fan-spray (NMP Recirculated, Heated); Dispense C: HPC Needle-spray (NMP Recirculated, Heated); continuous-duty 35:1 high-pressure pump and high-pressure filter; heater-SS 2-kW single path (Dispense A); heater-SS 2-kW dual path (Dispense B&C)[1]
- Dispense Arm 3
- Dual-position feedback; Dispense A: LPD stream (NMP Recirculated, Heated); Dispense B: High-velocity spray (NMP Recirculated, Heated); shared heater-SS 3-kW, single path[1]
- Wall-mounted dispenses
- Stationary with adjustable nozzles; wall-dispense nozzle (NMP Recirculated or Fresh, Heated); shared heater-SS 3-kW, single path (Wall Dispense, Backside Rinse A&B)[1]
Vacuum & pumping7
- vacuum paddles (4)[1]
- Recirculation, While Knight pump with 9.0-µm and 0.1-µm filters[1]
- Robotic wafer handler
- Vertical, rotary, two paddle axes; additional paddle axis (2); vacuum paddles (4); wafer alignment with LED backlight, color camera, and PC image processing; handler cover drain[1]
- Station 2
- MLO Spin Process chamber with grip actuator and spindle motor; Haler chamber with exhaust pressure, temperature and cover interlock sensors; CCD camera for chamber monitoring and video archive with LED lighting; spin chuck-200/300mm (Active Edge Grip, Stainless Steel)[1]
- Station 3
- SRD Spin Process chamber with grip actuator and spindle motor; Haler chamber with exhaust pressure, temperature and cover interlock sensors; CCD camera with LED lighting; O2 monitoring system with high-flow N2 purge and O2 sensor integrated into the chamber exhaust[1]
- 02 Monitoring system
- High-flow N2 purge with 02 sensor integrated into the chamber exhaust[1]
Wafer handling8
Gas & chemistry3
Optics & imaging2
Control & software8
Configuration & options28
- Single 300mm FOUP load port for high volume platform[1]
- Stainless steel with mirror finish[1]
- CO2 Fire suppression system for 90" frame[1]
- 3-Color LED status light lower (red, yellow, green)[1]
- ULPA Filter with Air Ionizer bar (Standard ESD level l)[1]
- vertical, rotary, two paddle axes[1]
- additional paddle axis (2)[1]
- Backside dispenses
- Adjustable nozzles; backside nozzle-A&B: LPD Stream (NMP Recirculated or Fresh, Heated)[1]
- Dispense Arm 2 Station 3
- Dual-position feedback; Dispense A: LPD stream (IPA Ambient); Dispense B: High-velocity spray (IPA Ambient)[1]
- Dispense Arm 4 Station 3
- Dual-position feedback; N2 heated dispense with programmable 400-W heater, 0.003-µm filter[1]
- Wall-mounted dispenses Station 3
- Stationary with adjustable nozzles; wall-dispense nozzle A: (IPA, Ambient); backside nozzles-A&B: (IPA, Ambient); chamber rinse--6 nozzles (IPA, Ambient); drain diverter Teflon 3-way (IPA drain/Industrial drain)[1]
- Dispense A
- LPD stream (NMP Recirculated, Heated) Dispense B: High-velocity spray (NMP Recirculated, Heated)[1]
- Dispense B
- High-velocity spray (IPA Ambient) - Dispense Arm 3 with dual-position feedback[1]
- Wall-dispense nozzle A
- (IPA, Ambient) Backside dispenses with adjustable nozzles Backside nozzles-A&B: (IPA, Ambient)[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configurationvacuum paddles (4)[1]
- Station 1Solvent Immersion 200/300mm (Fill by NMP Fresh Supply)[1]
- ConfigurationSolvent immersion station, SS construction with 2-kW heater and vertical agitation[1]
- ConfigurationRecirculation, While Knight pump with 9.0-µm and 0.1-µm filters[1]
- Robotic wafer handlerVertical, rotary, two paddle axes; additional paddle axis (2); vacuum paddles (4); wafer alignment with LED backlight, color camera, and PC image processing; handler cover drain[1]
- Station 1Solvent Immersion 200/300mm (Fill by NMP Fresh Supply); SS construction with 2-kW heater and vertical agitation; recirculation While Knight pump with 9.0-µm and 0.1-µm filters; cooling coils; heater-SS 3-kW, single path; 6kW total heat (2); DFR solvent strainer triple-stage with automatic flush feature[1]
- Station 2MLO Spin Process chamber with grip actuator and spindle motor; Haler chamber with exhaust pressure, temperature and cover interlock sensors; CCD camera for chamber monitoring and video archive with LED lighting; spin chuck-200/300mm (Active Edge Grip, Stainless Steel)[1]
- Dispense Arm 2Dual-position feedback; Dispense A: LPD stream (NMP Fresh or Recirculated, Heated); Dispense B: HPC Fan-spray (NMP Recirculated, Heated); Dispense C: HPC Needle-spray (NMP Recirculated, Heated); continuous-duty 35:1 high-pressure pump and high-pressure filter; heater-SS 2-kW single path (Dispense A); heater-SS 2-kW dual path (Dispense B&C)[1]
- Dispense Arm 3Dual-position feedback; Dispense A: LPD stream (NMP Recirculated, Heated); Dispense B: High-velocity spray (NMP Recirculated, Heated); shared heater-SS 3-kW, single path[1]
- Wall-mounted dispensesStationary with adjustable nozzles; wall-dispense nozzle (NMP Recirculated or Fresh, Heated); shared heater-SS 3-kW, single path (Wall Dispense, Backside Rinse A&B)[1]
- Drain diverter Station 2Teflon 3-way (NMP recirculation/Solvent drain)[1]
- Station 3SRD Spin Process chamber with grip actuator and spindle motor; Haler chamber with exhaust pressure, temperature and cover interlock sensors; CCD camera with LED lighting; O2 monitoring system with high-flow N2 purge and O2 sensor integrated into the chamber exhaust[1]
- Heater-SS 3-kW, single path6kW total heat (2)[1]
- DFR solvent strainerTriple-Stage with automatic flush feature[1]
- Continuous-duty 351 high-pressure pump and high-pressure filter[1]
- 02 Monitoring systemHigh-flow N2 purge with 02 sensor integrated into the chamber exhaust[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the WaferStorm 3303 Automated Solvent Processor are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the WaferStorm 3303 Automated Solvent Processor are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the WaferStorm 3303 Automated Solvent Processor are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the WaferStorm 3303 Automated Solvent Processor are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the WaferStorm 3303 Automated Solvent Processor are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the WaferStorm 3303 Automated Solvent Processor is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]inventory listing
Last updated Oct 13, 2026.
Compare with similar tools
View all →The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.