Waferpedia

Comparison ledger

0332 F 9453 302 Diffusionversus6-2P-CP

Varian 0332 F 9453 302 Diffusion, YES 6-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
OEMVarianYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyVarian 0332 F 9453 302 DiffusionYES 6-2P-CP
Cited variants—
Specifications
Asset Number142841[2]—
Last Confirm DateOctober 14, 2025[3]—
MakeVarian[2]—
Model0332 F 9453 302[2]6-2P-CP[1]
CategoryThermal / Diffusion[4]—
Tool typediffusion pump[4]high temperature cure oven[5]
Series—PB Series (manual load)[5]
Wafer size—150 mm wafers[1]
Process type—high temperature cure oven[5]
Operation—manual load[5]
Atmosphere/process control—dry inert atmosphere, pressure control, uniform temperature distribution, control of heating and cooling rates[5]
Cooling package—air only, no water[5]
Airflow—vertical laminar airflow[5]
Model designation—YES 6-2P-CP[1]
Load type—manual load[5]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]Equipment inventory listing
  3. [3]fab-spares.comfab-spares.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]web.archive.orgweb.archive.org