Waferpedia

YES

6-2P-CP

Thermal / Diffusion150mmYES 6-2P-CP family
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YES6-2P-CP
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What it is

The YES 6-2P-CP is a manual-load high-temperature vacuum cure oven manufactured by Yield Engineering Systems. The machine belongs to the YES-PB Series of polyimide cure ovens designed for batch processing of semiconductor wafers and MEMS devices.[1]

How it works

The YES-PB Series ovens use vertical laminar airflow to carry particulates away from wafers, directing air from the top of the chamber and out the bottom to reduce turbulence. A coalescing condensate trap collects solvent vapors that condense during the cure process, preventing plugging of vacuum lines and protecting pump performance.[2][1]

The oven incorporates a cooling package that uses only air, not water, to control chamber cooling rates. The design allows adjustment of the air mixing ratio to achieve uniform temperature distribution and controlled ramp-down rates over a broad range of operating temperatures.[2][1]

The YES-PB Series ovens maintain a dry inert atmosphere with extremely low oxygen concentrations. The process chamber supports vacuum operation for removal of residual solvents and moisture, and the system includes a touch-screen interface for automated recipe control.[1]

Applications

The YES-PB Series ovens are used for curing polyimide and PBO in wafer-level packaging and redistribution layer applications. Other applications include BCB bake, low-temperature polymer cure, copper anneal, low-k dielectric cure, copper oxide removal, and aluminum anneal.[1]

The ovens are also employed for dehydration bake, surface modification, and vapor phase deposition processes such as silane coating and adhesion promotion for MEMS and advanced packaging.[1]

  • Polyimide bake
  • BCB bake
  • Copper anneal
  • Low-K dielectric cure
  • Copper oxide removal
  • Aluminum anneal
  • Polyimide/PBO cure
  • Polyimide cure/bake/anneal
  • Dehydration bake

What do the numbers mean?

Vacuum & pumping1

Atmosphere/process control
dry inert atmosphere, pressure control, uniform temperature distribution, control of heating and cooling rates[1]
Accurate?

Wafer handling2

Wafer size
150 mm wafers[2]
Accurate?
Wafer size
150 mm[1]
Accurate?

Configuration & options6

Series
PB Series (manual load)[1]
Accurate?
Model
6-2P-CP[2]
Accurate?
Process type
high temperature cure oven[1]
Accurate?
Operation
manual load[1]
Accurate?
Cooling package
air only, no water[1]
Accurate?
Airflow
vertical laminar airflow[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
YES 6-2P-CPSpecs listed for 150 mm wafers.web.archive.org[2]
YES 8-2P-CPSpecs listed for 200 mm wafers.web.archive.org[2]
YES 12-2P-CPSpecs listed for 300 mm wafers.web.archive.org[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Atmosphere/process controldry inert atmosphere, pressure control, uniform temperature distribution, control of heating and cooling rates[1]

Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the 6-2P-CP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6-2P-CP are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 6-2P-CP are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 6-2P-CP are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 6-2P-CP is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 6-2P-CP are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.orgweb.archive.org
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Last updated Aug 13, 2026.

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