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0332 F 9453 302 DiffusionversusPB12-2P-CP

Varian 0332 F 9453 302 Diffusion, YES PB12-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMVarianYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—12 in.
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyVarian 0332 F 9453 302 DiffusionYES PB12-2P-CP
Cited variants—
  • YES PB12-2P-CP[1]
Specifications
Asset Number142841[2]—
Last Confirm DateOctober 14, 2025[3]—
MakeVarian[2]—
Model0332 F 9453 302[2]PB12-2P-CP[1]
CategoryThermal / Diffusion[4]Thermal / Diffusion[6]
Tool typediffusion pump[4]high-temperature vacuum bake/cure oven[6]
Wafer capacity—2 cassettes of 12 in. wafers[1]
Chamber configuration—single compartment[1]
Chamber size—14.5 in. x 21 in. x 27 in. deep chamber[1]
Controller—CTC Controller with Color Touchscreen[1]
Included package—Cooling Package[1]
Chamber dimensions (OEM source)—14.5 in. x 21 in. x 27 in. deep chamber[1]
Chamber dimensions (secondary source)—21 in. barrel x 40.97 in. deep[5]
Maximum temperature—450 °C[1]
Recipe capability—8 recipes with up to 16 ramps and dwells each[1]
N2 flow rate—1 SCFM[5]
Chamber cleanliness—Class One[5]
Electrical requirements—208 V, 3 phase, 30 A, 50/60 Hz[5]
Wafer size—12 in.[6]
Process—BCB/polyimide[6]
Cooling package—included[6]
Interior chamber dimensions—14.5 in. x 21 in. x 27 in. deep[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]Equipment inventory listing
  3. [3]fab-spares.comfab-spares.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]waferpedia.comwaferpedia.com