Waferpedia

Comparison ledger

O Inspect 322 CMM versus Sigma HDVP

Zeiss O Inspect 322 CMM and Zeiss Sigma HDVP, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
OEMZeissZeiss
CategoryMetrology & InspectionMetrology & Inspection
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyZeiss O Inspect 322 CMMZeiss Sigma
Cited variants
  • O-INSPECT 3 / 2 / 2[1]
Specifications
ConfigurationMeasuring volume X = 300 mm, Y = 200 mm, Z = 200 mm[2]Electron source[3]
P/N636520-9932-000[1]
Acceleration voltage0.02 kV - 30 kV[3]
Magnification range10-1.000.000x[3]
Specimen chamber358 mm[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing