Comparison ledger
ABM -407B-2-S-CE-S293 Robot, STS 320, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 320STS | |
|---|---|---|
| OEM | ABM | STS |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | STS 320 |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[2] | — |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Reactive Ion Etch Type | — | Parallel-plate RIE[1] |
| RF Frequency | — | 13.56 MHz[1] |
| Driven Electrode Area | — | 900 cm²[1] |
| Process Gases | — | SF6, SF6+O2, CF4, CF4+O2[1] |
| Pressure (typical) | — | 55 mtorr[1] |
| OEM | — | Surface Technology Systems[1] |
| Tool type | — | parallel-plate RIE tool[1] |
| Driven electrode area | — | about 900 cm2[1] |