Comparison ledger
ABM Mask, Nikon 1505 G 6 E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MaskABM | 1505 G 6 ENikon |
|---|---|---|
| OEM | ABM | Nikon |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 1988– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM Mask | Nikon 1505 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Using 1000 Watt DUV light source[3] | 5" reticle[4] |
| Tool type | Mask aligner[3] | — |
| Wafer sizes | 2 in, 3 in, 4 in, 12 in[3] | — |
| Substrate capability | From 100 mm down to small pieces[1] | — |
| Light source | 1000 Watt DUV light source[3] | — |
| Mask size | Up to 5 in[3] | — |
| Tool manufacturer | ABM[1] | — |
| Tool model | 3000HR[1] | — |
| Exposure methods | Flood, soft, hard, and vacuum contact[2] | — |
| Exposure wavelengths | 365 nm to 400 nm[2] | — |
| Resolution | 800 nm[2] | 650 nm[5] |
| Alignment | top-side alignment[1] | — |
| Mask requirement | requires a 5 inch mask or 5 inch glass plate with film mask[1] | — |
| Primary application | SU8 exposure[1] | — |
| Secondary application | aligning PDMS components for PDMS-to-PDMS bonding[1] | — |
| Numerical Aperture | — | 0.54[5] |
| Reduction | — | 5x[5] |
| Exposure Field | — | 15 x 15 mm[5] |
| Alignment Accuracy | — | 130 nm[5] |
| Wafer Size | — | 4 inch[4] |
| Light Source | — | g-line[6] |
| Introduction Year | — | 1988[5] |
| NA (Numerical Aperture) | — | 0.54[5] |
| Make | — | Nikon[4] |
| Model | — | 1505 G 6 E[4] |
| Category | — | Stepper[4] |
| Wafer Sizes | — | 4 inch[4] |
| Exposure type | — | g-line[5] |
| NA | — | 0.54[5] |
| Exposure field | — | 9.3 x 18.8 mm[5] |
Plan your fab
Building a Lithography process? Get a complete equipment list.
Open the fab equipment planner →