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HRG 200versusHRG 200 X

Accretech HRG 200, Accretech HRG 200 X, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
HRG 200Accretech
HRG 200 XAccretech
OEMAccretechAccretech
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech HRG 200Accretech HRG 200
Specifications
ConfigurationHigh Rigid[1]—
ManufacturerAccretech[2]—
ModelHRG 200[1]—
Tool typeGrinder[1]—
DescriptionHigh rigid twin-axis system[2]—
Grinding Wheel Diameter—250 mm[3]
Grinding Wheel Spindle Speed—Max. 3600 rmp[3]
Working Spindle Speed—800 rpm[3]
Motor Power—6.3 KW[3]
Wafer Sizes—2, 3, 4, 5, 6, 8 inch[3]
Wafer Size Range—2-inch to 8-inch wafers[4]
Machine Type—Fully Automatic High Rigid 2-Axis Grinder[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]accretech.comaccretech.com