Waferpedia

Accretech

HRG 200

Dicing & GrindingAccretech HRG 200 family
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HRG 200 — Inventory photo
Fig. 01HRG 200Inventory photo[1]

What it is

The Accretech HRG 200 is a grinder in the dicing and grinding equipment category.[1][2]

The HRG 200 is a high rigid twin-axis system.[1][2]

How it works

The HRG 200 X has a grinding wheel diameter of 250 mm.[3]

The HRG 200 X has a maximum grinding wheel spindle speed of 3600 rpm and a working spindle speed of 800 rpm.[3]

Where it fits in the process flow

The HRG 200 X sits in backend wafer processing where grinding and thickness reduction are required.[3]

Applications

The HRG 200 family is used for semiconductor manufacturing where controlled material removal and a smooth ground surface are required.[3]

The HRG 200 X supports wafer preparation before later singulation or assembly steps.[3]

What do the numbers mean?

Configuration & options6

High Rigid[1]
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Twin Axis[1]
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Manufacturer
Accretech[2]
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Model
HRG 200[1]
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Tool type
Grinder[1]
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Description
High rigid twin-axis system[2]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of grinder is the HRG 200 X?

The HRG 200 X is a fully automatic high rigid two-axis grinder.[3]

What is the grinding wheel diameter on the HRG 200 X?

The HRG 200 X has a grinding wheel diameter of 250 mm.[3]

What are the spindle speeds on the HRG 200 X?

The HRG 200 X has a maximum grinding wheel spindle speed of 3600 rpm and a working spindle speed of 800 rpm.[3]

Not publicly documented

The following facts about the HRG 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the HRG 200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the HRG 200 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the HRG 200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the HRG 200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the HRG 200 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]HRG 200 X — Accretech | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 13, 2026.

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