Waferpedia

Comparison ledger

, Tokyo Semitsu Kogaku (TSK) UF200versus, Vistec INS 3000

Accretech , Tokyo Semitsu Kogaku (TSK) UF200, Leica , Vistec INS 3000, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMAccretechLeica
Category——
Wafer sizeWafer Equipment200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech , Tokyo Semitsu Kogaku (TSK) UF200Leica , Vistec INS 3000
Specifications
Wafer sizeWafer Equipment[1]Single 150/200 mm wafer loadport[2]
Date of Manufacture1998[1]—
Currently Configured for200mm[1]—
Current Equipment StatusAvailable[1]—
Available dateCurrently Available[1]—
Equipment categoryProduction Wafer Prober[1]—
Type—Optical defect review station[2]
Wafer loadport—Single 150/200 mm wafer loadport[2]
Lighting—Bright field light source; DIC DUV light source[2]
Camera—UV and DUV camera[2]
Optics—6 optics: 150x, 100x, 50x, 25x, 10x, 5x[2]
Software—Viscon Software[2]
Data interface—KLARF input[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]dealer listingwotol.com
  2. [2]dealer listingwotol.com