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Comparison ledger

, Tokyo Semitsu Kogaku (TSK) UF3000versusF10-RT

Accretech , Tokyo Semitsu Kogaku (TSK) UF3000, Filmetrics F10-RT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
F10-RTFilmetrics
OEMAccretechFilmetrics
Category——
Wafer sizeWafer Equipment6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech , Tokyo Semitsu Kogaku (TSK) UF3000Filmetrics F10-RT
Specifications
Wafer sizeWafer Equipment[1]—
Currently Configured for300mm[1]—
With ChillerSCU-600B[1]—
Section 1Tool General Information[1]—
Section 2Tool Specific Information[1]—
ManufacturerAccretech, Tokyo Semitsu Kogaku (TSK)[1]—
ModelUF3000[1]—
CategoryWafer Equipment[1]—
Equipment typeWafer Prober[1]—
Tool statusIn production[1]—
Tool locationCleanroom[1]—
ChillerSCU-600B[1]—
Vendor tool serial numberF24006MZ[1]—
Micron MISTI/LID numberFE3SKAA300(TMM)[1]—
Year2004[2]—
Quantity9[3]—
Short descriptionFully Automated Prober[3]—
Version300 mm[3]—
Nickel chuck12 inch[3]—
Front loading300 mm single FOUP loading[3]—
Robot bladeDual ceramic robot blade[3]—
Software versionS5.0FC4[3]—
Loader typeTSK[3]—
Chuck temperature range30~150℃[3]—
OCR camera typeType6[3]—
Auto card changeYes[3]—
Needle cleaning unit150 mm x 150 mm ceramics pad[3]—
ManipulatorHinge, MHF4000[3]—
Test system interfaceAL6050 & Focus3000[3]—
IncludesPrinter[3]—
Instrument type—optical spectrometer[4]
Use in source example—measured reflectivity of a 9-period SiO2/Ta2O5 DBR[5]
Example measurement wavelength—high reflectivity at approximately 1050 nm[5]
Alternate name—F10RT[4]
Measurement capability—Reflectivity[5]
Sources (5)Every fact above is drawn from these public sources
  1. [1]dealer listingwotol.com
  2. [2]wotol.comwotol.com
  3. [3]wotol.comwotol.com
  4. [4]wiki.nanofab.ucsb.eduwiki.nanofab.ucsb.edu
  5. [5]wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu