Comparison ledger
Accretech W-GM-4200 Wafer Edge, Disco 321, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | W-GM-4200 Wafer EdgeAccretech | 321Disco |
|---|---|---|
| OEM | Accretech | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 150mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech W-GM-4200 Wafer Edge | Disco 321 |
| Specifications | ||
| Voltage | AC200V +-5% 3ø[1] | — |
| Power Consumption | 5.0 KVA[2] | — |
| Main Air Source | 0,56Mpa[2] | — |
| Spindle Air Source | 0,56Mpa[2] | — |
| Grinding and Cleanig Water | 15L/min, 0.3Mpa, 18°C recommended[2] | — |
| Mist Exhaust | 5m3/min[2] | — |
| Wafer size | 150mm, 200mm[2] | — |
| Wafer Thickness | 0,4-1,0mm[2] | — |
| Wafer type | Wafer with OF or notch[2] | — |
| Notch Angle | 89deg – 95deg[2] | — |
| Notch Angle Setting Value | 0,001deg step[2] | — |
| Grinding Unit | Left/Right[2] | — |
| Grinding wheel | For Periphery and for Notch[2] | — |
| Periphery Grinding wheel speed | 2500m/min (wheel 200mm, at 4000rpm)[2] | — |
| Configuration | Rotational Frequency of Spindle for Notch: 70000-94000rpm[2] | — |
| Driving System for Peripheral Grinding | Built-in by inverter motor[2] | — |
| Driving System for Notch Grinding | Air bearing system[2] | — |
| Make | Accretech / TSK[3] | — |
| Model | W-GM-4200[3] | 321[4] |
| Wafer Sizes | 6 inch[3] | — |
| Rotational Frequency of Spindle for Notch | 70000-94000rpm[2] | — |
| 4 cassette loading stages | for wafer size of 6” and 8”[2] | — |
| OEM | — | Disco[4] |
| Equipment type | — | Wafer Dicing Saw[4] |
| Facility context | — | Cleanroom Instrumentation[4] |
| Application area | — | Nano and Micro Fabrication[4] |
| Location | — | FNT 4.106[4] |
| Wafer Size | — | Up to 6 inches[5] |
| Spindle Power | — | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[6] |
| Spindle Power (alternate) | — | 1500 Watt spindle[5] |
| Non-Contact Setup | — | Non Contact Setup[6] |
| Microscope | — | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[6] |
| Broken Blade Detection | — | Broken Blade Detection[6] |
| Light Tower | — | Includes Light Tower[6] |
| Chuck Type | — | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[5] |
| Wafer size capability | — | Up to 6" wafers[6] |
| Chuck | — | 6-inch porous film frame chuck[5] |
| Spindle power | — | 1500-watt spindle[5] |
| Footprint | — | Small footprint[5] |
| Setup | — | Non-contact setup[6] |
| Blade break detection | — | Broken blade detection[6] |
| Other features | — | Floppy drive, light tower, blade tools, manuals[6] |
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