Accretech
W-GM-4200 Wafer Edge
What it is
General reference — not yet source-verifiedWafer edge grinders process the outer edge region of a wafer rather than the device surface pattern. Wafer edge grinding is used to shape and finish the wafer periphery and notch so the wafer can move through later handling and thinning operations with controlled edge condition.
How it works
The W-GM-4200 uses a built-in inverter motor to drive the wheel for peripheral grinding. The W-GM-4200 uses an air bearing system to drive the spindle for notch grinding. The W-GM-4200 is configured with left and right grinding units. The W-GM-4200 uses grinding wheels for periphery grinding and for notch grinding. The W-GM-4200 has a periphery grinding wheel speed of 2500 m/min with a 200 mm wheel at 4000 rpm. The W-GM-4200 has a notch-spindle rotational frequency range of 70000 rpm to 94000 rpm. The W-GM-4200 supports wafers with an OF or a notch. The W-GM-4200 has a notch angle range of 89 degrees to 95 degrees. The W-GM-4200 has a notch angle setting value of 0.001 degree steps.[1][2]
Where it fits in the process flow
Applications
General reference — not yet source-verifiedWafer edge grinders are used where the wafer perimeter and orientation feature need controlled mechanical finishing. Typical applications include preparing wafers for later thinning, reducing edge defects that can contribute to breakage, and refining notch or flat geometry for downstream wafer handling.
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
Wafer handling7
Configuration & options15
- Rotational Frequency of Spindle for Notch: 70000-94000rpm[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer thickness range does the W-GM-4200 handle?
The W-GM-4200 handles wafer thickness from 0.4 mm to 1.0 mm.[1][2]
What driving systems does the W-GM-4200 use for peripheral and notch grinding?
The W-GM-4200 uses a built-in inverter motor for peripheral grinding and an air bearing system for notch grinding.[1][2]
Not publicly documented
The following facts about the W-GM-4200 Wafer Edge are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the W-GM-4200 Wafer Edge are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the W-GM-4200 Wafer Edge are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the W-GM-4200 Wafer Edge are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the W-GM-4200 Wafer Edge are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the W-GM-4200 Wafer Edge is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]Equipment inventory listing
Last updated Oct 17, 2026.
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