Accretech

W-GM-4200 Wafer Edge

Dicing & Grinding 150mm Accretech W-GM-4200 Wafer Edge family

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W-GM-4200 Wafer Edge — Inventory photo — Fig. 01W-GM-4200 Wafer EdgeInventory photo^[1]

Wafer size

150mm

Power

AC200V +-5% 3ø^[1]

Vacuum

5m3/min^[1]

How it works

For peripheral grinding, the W-GM-4200 uses a built-in inverter motor to drive the wheel. The periphery grinding wheel rotates at 2500 m/min (with a 200 mm wheel at 4000 rpm). For notch grinding, an air bearing system drives the spindle over a rotational frequency range of 70,000 to 94,000 rpm. The system is configured with left and right grinding units. The machine requires a main air source at 0.56 MPa, a spindle air source at 0.56 MPa, grinding and cleaning water at 15 L/min and 0.3 MPa (recommended 18 °C), and a mist exhaust of 5 m³/min.^[1]

What do the numbers mean?

Power & electrical1

Voltage: AC200V +-5% 3ø^[1]

Vacuum & pumping1

Mist Exhaust: 5m3/min^[1]

Wafer handling4

Wafer size: 150mm, 200mm^[1]
Wafer Thickness: 0,4-1,0mm^[1]
Wafer type: Wafer with OF or notch^[1]
Wafer size: 4 cassette loading stages for wafer size of 6” and 8”^[1]

Configuration & options12

Power Consumption: 5.0 KVA^[1]
Main Air Source: 0,56Mpa^[1]
Spindle Air Source: 0,56Mpa^[1]
Grinding and Cleanig Water: 15L/min, 0.3Mpa, 18°C recommended^[1]
Notch Angle: 89deg – 95deg^[1]
Notch Angle Setting Value: 0,001deg step^[1]
Grinding Unit: Left/Right^[1]
Grinding wheel: For Periphery and for Notch^[1]
Periphery Grinding wheel speed: 2500m/min (wheel 200mm, at 4000rpm)^[1]; Rotational Frequency of Spindle for Notch: 70000-94000rpm^[1]
Driving System for Peripheral Grinding: Built-in by inverter motor^[1]
Driving System for Notch Grinding: Air bearing system^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

VoltageAC200V +-5% 3ø^[1]
Mist Exhaust5m3/min^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the notch angle range and resolution?

The notch angle range is 89° to 95°, with a setting resolution of 0.001° steps.^[1]

What driving systems does the machine use for the grinding spindles?

Peripheral grinding uses a built-in inverter motor; notch grinding uses an air bearing system.^[1]

Not publicly documented

The following facts about the W-GM-4200 Wafer Edge are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the W-GM-4200 Wafer Edge are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the W-GM-4200 Wafer Edge are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the W-GM-4200 Wafer Edge are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the W-GM-4200 Wafer Edge are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the W-GM-4200 Wafer Edge is not on record.
Answerable by: an OEM datasheet or a fab qualification report