Comparison ledger
Accretech W-GM-4200 Wafer Edge, Disco DAD3221, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | W-GM-4200 Wafer EdgeAccretech | DAD3221Disco |
|---|---|---|
| OEM | Accretech | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech W-GM-4200 Wafer Edge | Disco DAD3221 |
| Specifications | ||
| Voltage | AC200V +-5% 3ø[1] | — |
| Power Consumption | 5.0 KVA[2] | — |
| Main Air Source | 0,56Mpa[2] | — |
| Spindle Air Source | 0,56Mpa[2] | — |
| Grinding and Cleanig Water | 15L/min, 0.3Mpa, 18°C recommended[2] | — |
| Mist Exhaust | 5m3/min[2] | — |
| Wafer size | 150mm, 200mm[2] | 100, 150 mm wafers[4] |
| Wafer Thickness | 0,4-1,0mm[2] | — |
| Wafer type | Wafer with OF or notch[2] | — |
| Notch Angle | 89deg – 95deg[2] | — |
| Notch Angle Setting Value | 0,001deg step[2] | — |
| Grinding Unit | Left/Right[2] | — |
| Grinding wheel | For Periphery and for Notch[2] | — |
| Periphery Grinding wheel speed | 2500m/min (wheel 200mm, at 4000rpm)[2] | — |
| Configuration | Rotational Frequency of Spindle for Notch: 70000-94000rpm[2] | — |
| Driving System for Peripheral Grinding | Built-in by inverter motor[2] | — |
| Driving System for Notch Grinding | Air bearing system[2] | — |
| Make | Accretech / TSK[3] | — |
| Model | W-GM-4200[3] | — |
| Wafer Sizes | 6 inch[3] | — |
| Rotational Frequency of Spindle for Notch | 70000-94000rpm[2] | — |
| 4 cassette loading stages | for wafer size of 6” and 8”[2] | — |
| Type | — | automatic dicing saw[4] |
| Setup | — | non-contact setup[4] |
| Blade monitoring | — | blade breakage detector[4] |
| Cutting functions | — | circle cut for edge trimming or down sizing[4] |
| Particle/ESD mitigation | — | CO2 injector to prevent particle adhesion and electrostatic discharge damage[4] |
| Alignment aids | — | pattern recognition system; automatic micro-alignment[4] |
| Equipment type | — | Automatic dicing saw[4] |
| Wafer / substrate size | — | 100, 150 mm wafers[4] |
| Substrate size | — | up to 150mm diameter[5] |
| Max. workpiece size | — | Φ6 inch (150 mm × 150mm user-specified specification)[6] |
| Non-contact setup | — | Yes[4] |
| Blade breakage detector | — | Yes[4] |
| Circle cut | — | For edge trimming or downsizing[4] |
| CO2 injector | — | Prevents particle adhesion and electrostatic discharge damage[4] |
| Pattern recognition system | — | Yes[4] |
| Automatic micro-alignment | — | Yes[4] |
| Spindle layout | — | Single[6] |
| Standard rated output | — | 2.0 kW at 40,000 min-1[6] |
| Optional rated output | — | 1.8 kW at 60,000 min-1[6] |
| Equipment dimensions | — | 490 × 870 × 1,670 mm[6] |
| Equipment weight | — | Approx. 420 kg[6] |
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