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W-GM-4200 Wafer Edgeversus15

Accretech W-GM-4200 Wafer Edge, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMAccretechLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size150mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech W-GM-4200 Wafer EdgeLapmaster 15
Specifications
VoltageAC200V +-5% 3ø[1]—
Power Consumption5.0 KVA[2]—
Main Air Source0,56Mpa[2]—
Spindle Air Source0,56Mpa[2]—
Grinding and Cleanig Water15L/min, 0.3Mpa, 18°C recommended[2]—
Mist Exhaust5m3/min[2]—
Wafer size150mm, 200mm[2]—
Wafer Thickness0,4-1,0mm[2]—
Wafer typeWafer with OF or notch[2]—
Notch Angle89deg – 95deg[2]—
Notch Angle Setting Value0,001deg step[2]—
Grinding UnitLeft/Right[2]—
Grinding wheelFor Periphery and for Notch[2]—
Periphery Grinding wheel speed2500m/min (wheel 200mm, at 4000rpm)[2]—
ConfigurationRotational Frequency of Spindle for Notch: 70000-94000rpm[2]—
Driving System for Peripheral GrindingBuilt-in by inverter motor[2]—
Driving System for Notch GrindingAir bearing system[2]—
MakeAccretech / TSK[3]—
ModelW-GM-4200[3]—
Wafer Sizes6 inch[3]—
Rotational Frequency of Spindle for Notch70000-94000rpm[2]—
4 cassette loading stagesfor wafer size of 6” and 8”[2]—
Input Power—110 Vac[4]
Plate Diameter—15 inches (381 mm)[5]
Number of Conditioning Rings—3[5]
Ring ID—5.5 inches (140 mm)[5]
Standard RPM—60[5]
RPM Range (Variable Speed Drive)—0-60[5]
Drive Motor - Lapper—0.5 HP (0.37 kW)[5]
Drive Motor - Polisher—0.75 HP (0.56 kW)[5]
Length—25 inches (635 mm)[5]
Width—20 inches (508 mm)[5]
Height—24 inches (610 mm)[5]
Estimated Shipping Weight—285 lbs (129.3 kg)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org