Comparison ledger
ADT 8020 Auto Twin Dicing, Disco DFD 6340 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | ADT | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ADT 8020 Auto Twin Dicing | Disco DFD 6340 |
| Specifications | ||
| Manufacturer | ADT[2] | — |
| Model | 8020[2] | DFD 6340[1] |
| Machine type | Fully automatic twin dicing system[3] | Automatic dicing saw[1] |
| Workpiece size | Ø 8"[4] | — |
| Wafer sizes | 8 inch[2] | — |
| Spindles | Two facing spindles[4] | — |
| Blade size | 2" - 3"[4] | — |
| Max spindle speed | 60,000 rpm[4] | — |
| Spindle power | 1.2 kW[4] | — |
| Vision system | USB3 camera, high bright LED illumination (vertical & oblique)[4] | — |
| User interface | 2 touch screens: 19" main screen and 17" maintenance screen[4] | — |
| OS | Win7[4] | — |
| Options | BBD (Broken Blade Detector), barcode reader, UV station, USB3 camera with continuous digital magnification from x70 to x290, dress station, dress cassette, ESD kit, high definition optics, Geometric Model Finder (GMF), Dicing Floor Management (SECS/GEM), customization utilities[4] | — |
| Applications | Silicon wafers, discrete devices, silicon carbide (SiC), MEMS, SAW devices, glass wafer, packaging (QFN, LED…)[4] | — |
| Workpiece Size | 8 inch[4] | — |
| Spindle Configuration | Two facing spindles[4] | — |
| Spindle Speed | Max. 60,000 rpm[4] | — |
| Spindle Power | 1.2 kW (standard); optional 1.8 kW or 2.4 kW[4] | — |
| Blade Size | 2 - 3 inches[4] | — |
| X Axis Feed Rate | Up to 600 mm/sec[4] | — |
| X Axis Stroke | 210 mm[4] | — |
| Y Axis Indexing Accuracy | 1.0 μm[4] | — |
| Y Axis Cumulative Accuracy | 1.5 μm[4] | — |
| Y Axis Cutting Range | 210 mm[4] | — |
| Z Axis Stroke | 30 mm (for 2.188 inch blade OD)[4] | — |
| Z Axis Resolution | 0.2 μm[4] | — |
| θ Axis Repeatability | 4 arc-sec[4] | — |
| θ Axis Stroke | 350°[4] | — |
| Cleaning Station Spin Speed | 100 - 2,000 rpm[4] | — |
| User Interface | Two touch screens: 19-inch main, 17-inch maintenance; NUI, multilanguage, Win7 OS[4] | — |
| Dimensions (W x D x H) | 1,015 mm x 1,460 mm x 1,820 mm[4] | — |
| Weight | 1,300 kg[4] | — |
| Electrical | 200-240 VAC, 50/60 Hz, single phase[4] | 3 Phase[8] |
| Environment Temperature | 20°C to 25°C ± 1°C[4] | — |
| Humidity | Less than 70% relative humidity (non-condensing)[4] | — |
| Configuration | — | Missing ZI motor[1] |
| Phase | — | 3 Phase[5] |
| Voltage | — | 220 Vac[5] |
| Make | — | Disco[1] |
| Wafer size | — | 8 inch[7] |
| Electrical configuration | — | 3 Phase, 3 Wire + Ground, 220 Vac, 50/60 Hz[5] |
| Example unit vintage | — | 2013[1] |
| OEM | — | Disco[1] |
| Equipment type | — | Automatic Dicing Saw[1] |
| Vintage | — | 2013[1] |
| Spindle Power Options | — | 1.2 / 1.8 / 2.2 kW[9] |
| X-axis Cutting Range | — | 210 mm[9] |
| X-axis Cutting Speed | — | 0.1-600 mm/s[9] |
| Y1 / Y2 Axis Cutting Range | — | 210 mm[9] |
| Y-axis Index Step | — | 0.0001 mm[9] |
| Z-axis Repeatability | — | 0.001 mm[9] |
| Main Process | — | Wafer Dicing / Package Singulation[9] |
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