Comparison ledger
AJA ATC 2200, Varian CC2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ATC 2200AJA | CC2Varian |
|---|---|---|
| OEM | AJA | Varian |
| Category | Deposition | Deposition |
| Wafer size | 6" | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | AJA ATC 2200 | Varian CC2 |
| Cited variants | — |
|
| Specifications | ||
| Tool type | PVD tool; UHV sputtering system[2] | — |
| Sputtering sources | 330-XP (UHV) magnetron sputtering sources in con-focal orientation[2] | — |
| Source shutters | Pneumatic source shutters[2] | — |
| Gas injection | Integral gas injection to source head for reactive sputtering and low pressure operation[2] | — |
| Tilt adjustment | In-situ tilt gimbals with locking UHV position indicator; allows source head angle adjustment without breaking vacuum[2] | — |
| Viewports | 6" CF viewports[2] | — |
| Substrate size | To 6"[2] | — |
| Heating | Radiant heating to 800 C with quartz halogen lamps[2] | — |
| Power sources | DC and RF generators[2] | — |
| Ion source | Kaufman KDC 40 4cm gridded ion source[2] | — |
| Control system | Phase II-J Computer Control System[2] | — |
| Process type | PVD sputtering system[2] | — |
| Magnetron sources | 330-XP (UHV) magnetron sputtering sources in confocal orientation[2] | — |
| Reactive sputtering gas injection | Integral gas injection to source head for reactive sputtering and low pressure operation[2] | — |
| Source head adjustment | In-situ tilt gimbals with locking UHV position indicator[2] | — |
| Viewport size | 6" CF viewports[2] | — |
| Power supplies | DC and RF generators[2] | 2 RF power supplies and a switchable DC power supply[3] |
| manual listed | — | Varian CC2 Manual[3] |
| film deposition type | — | sputter deposition of metals, alloys, and insulating thin films[3] |
| stage diameter | — | 6" diameter stage[3] |
| co-sputter capability | — | co sputter capable[3] |
| reactive sputtering | — | available (Nitrogen or Oxygen)[3] |
| Model | — | CC2 (senTorr CC2)[3] |
| Part Number | — | L91213020000[1] |
| OEM | — | Varian[1] |
| Process | — | Sputter deposition of metals, alloys, and insulating thin films[3] |
| Film thickness | — | Controllable from a few nm to hundreds of nm[3] |
| Cathodes | — | Three 3-inch diameter confocal cathodes[3] |
| Co-sputter capability | — | Yes[3] |
| Reactive sputtering | — | Available with nitrogen or oxygen[3] |
| Stage diameter | — | 6-inch diameter stage[3] |
| Substrate rotation | — | +/- 10% uniformity[3] |
| Vacuum system | — | Cryo and turbo pumped to 1 x 10^7 Torr[3] |
| Substrate heat | — | Up to 200 C[3] |
| Liftoff deposition | — | Supported with sputter power[3] |
| Argon pressure range | — | 3-15 mT[3] |
| MFC controller | — | 200 sccm MFC controller, no APC valve[3] |
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