AJA

ATC 2200

Deposition 6"AJA ATC 2200 family

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ATC 2200 — pnf.uchicago.edu — Fig. 01ATC 2200pnf.uchicago.edu^[1]

Plate 01AJA ATC-2200-UHV deposition system sputtering system
SemiSell Corp.Watch on YouTube

Wafer size

Power

DC and RF generators^[1]

What is it?

The AJA ATC 2200 Sputtering System is described as a PVD tool that deposits films on a substrate by sputtering. The source lists con-focal 330-XP (UHV) magnetron sputtering sources, pneumatic source shutters, integral gas injection for reactive sputtering and low-pressure operation, in-situ tilt gimbals with a locking UHV position indicator, 6-inch CF viewports, substrate capacity to 6 inches, radiant heating to 800 C with quartz halogen lamps, DC and RF generators, a Kaufman KDC 40 4cm gridded ion source, and Phase II-J computer control.

What can it run?

Process applications and technology nodes documented for this tool.

Corrosion resistant coatings
Low friction coatings
Hard, wear resistant coatings
Coatings with specific electrical and optical properties

What do the numbers mean?

Power & electrical1

Power sources: DC and RF generators^[1]

Vacuum & pumping2

Gas injection: Integral gas injection to source head for reactive sputtering and low pressure operation^[1]
Tilt adjustment: In-situ tilt gimbals with locking UHV position indicator; allows source head angle adjustment without breaking vacuum^[1]

Wafer handling1

Substrate size: To 6"^[1]

Control & software1

Control system: Phase II-J Computer Control System^[1]

Configuration & options6

Tool type: PVD tool; UHV sputtering system^[1]
Sputtering sources: 330-XP (UHV) magnetron sputtering sources in con-focal orientation^[1]
Source shutters: Pneumatic source shutters^[1]
Viewports: 6" CF viewports^[1]
Heating: Radiant heating to 800 C with quartz halogen lamps^[1]
Ion source: Kaufman KDC 40 4cm gridded ion source^[1]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Gas injectionIntegral gas injection to source head for reactive sputtering and low pressure operation^[1]
Tilt adjustmentIn-situ tilt gimbals with locking UHV position indicator; allows source head angle adjustment without breaking vacuum^[1]
Power sourcesDC and RF generators^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the ATC 2200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ATC 2200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ATC 2200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ATC 2200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ATC 2200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ATC 2200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
[2]Sputter 4 (AJA ATC 2200-V) - UCSB Nanofab Wiki — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
[3]Batch Coater Sputter Systems — ajaint.com (Sep 22, 2023)web.archive.org