Waferpedia

Comparison ledger

0010-03254 E ChuckversusMps-4

Applied Materials 0010-03254 E Chuck, CHA Mps-4, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
OEMApplied MaterialsCHA
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—CHA Mps-4
Specifications
Model listing—CHA Mps-4 System[1]
Operation—Side sputtering operation[2]
Cathodes—Up to four DC or RF cathodes[2]
Substrate heating—360° substrate heating[2]
Shutters—Rotating shutters for positive thickness cutoff control[2]
Fixturing—Dual drive planetary[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]semiconductoronline.comsemiconductoronline.com