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CHA

Mps-4

CHA Mps-4 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Mps-4 — web.archive.org
Fig. 01Mps-4web.archive.org[1]

What it is

The CHA Mps-4 is a system in the CHA Industries systems lineup. The MPS-4 is designed for side sputtering operation with up to four DC or RF cathodes.[1][2]

How it works

The MPS-4 is designed for side sputtering operation with up to four DC or RF cathodes. The MPS-4 features substrate heating through a full circle and rotating shutters for thickness cutoff control. Standard system fixturing consists of a dual drive planetary. The orbit drive allows substrates to pass through the deposition zone or to be stopped in front of or near any cathode while the substrate spins on its own axis.[2]

What do the numbers mean?

Power & electrical1

Cathodes
Up to four DC or RF cathodes[2]
Accurate?

Wafer handling1

Substrate heating
360° substrate heating[2]
Accurate?

Control & software1

Shutters
Rotating shutters for positive thickness cutoff control[2]
Accurate?

Configuration & options3

Model listing
CHA Mps-4 System[1]2 sources
Accurate?
Operation
Side sputtering operation[2]
Accurate?
Fixturing
Dual drive planetary[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • CathodesUp to four DC or RF cathodes[2]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What kind of equipment is the CHA Mps-4?

The CHA Mps-4 is a system in the CHA Industries systems lineup. The MPS-4 is designed for side sputtering operation.[1][2]

How many cathodes can the MPS-4 support?

The MPS-4 is designed for operation with up to four DC or RF cathodes.[2]

Not publicly documented

The following facts about the Mps-4 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mps-4 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Mps-4 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Mps-4 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Mps-4 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Mps-4 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]semiconductoronline.com — semiconductoronline.comsemiconductoronline.com
  3. [3]Mps-4 — CHA | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 19, 2026.

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