Comparison ledger
Applied Materials 0010-03254 E Chuck, YES 199, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | 199YES |
|---|---|---|
| OEM | Applied Materials | YES |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | YES 199 |
| Specifications | ||
| Document topic | — | Processing procedures for BCB adhesion[1] |
| Material family | — | Cyclotene Advanced Electronic Resins / benzocyclobutene (BCB)[1] |
| Adhesion promoters discussed | — | AP3000 and AP8000[1] |
| Recommended adhesion promoters | — | AP3000 and AP8000 are the only adhesion promoters recommended for use with BCB[1] |
| Recommended pre-clean | — | O2 plasma, with or without water rinse[1] |
| Preferred plasma tool type | — | RIE-type plasma tools[1] |
| Adhesion test methods | — | Tape peel, modified edge lift-off (m-ELT), and bump shear[1] |
| Tape peel standard | — | ASTM D-3359-93[1] |
| Pressure cooker test conditions | — | 121°C, 2 atmospheres pressure, 100% relative humidity[1] |
| Thickness example | — | BCB bump shear squares are typically 100 μm x 100 μm[1] |