Waferpedia

Comparison ledger

0010-13622 RF Match forversusCentura 300 EPI

Applied Materials 0010-13622 RF Match for, Applied Materials Centura 300 EPI, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
Centura 300 EPIApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forApplied Materials Centura 300 EPI
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]—
Model0010-13622[1]Centura 300[2]
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
OEM—Applied Materials[2]
Process—Epitaxial Silicon Deposition[2]
Wafer Size—12 inch[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing