Comparison ledger
Applied Materials 0010-13622 RF Match for, Temescal BJD 2000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | BJD 2000Temescal |
|---|---|---|
| OEM | Applied Materials | Temescal |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Temescal BJD 2000 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Batch loading vacuum chamber w/ 20" diameter hinged bell jar[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| With | — | Two sets of removable shields for cleaning[2] |
| E-Beam Controller | — | Inficon Model XTC/3[2] |
| Process Controller | — | CTI Model CT-8 Onboard[2] |
| Power | — | 6 KW EBeam Power Supply[3] |
| Type | — | Batch-loading vacuum chamber evaporator[3] |
| Bell jar | — | 20" diameter hinged bell jar[2] |
| Load-lock status | — | Non-load-locked[4] |
| Vacuum pumping | — | Roughing Pump[3] |
| Sources supported | — | Multiple electron beam and resistance sources[4] |
| Source-to-substrate distance | — | Standard 19.5"; optional source well extension collar 27.5"[4] |
| EBeam gun | — | STIH-270-2CK[2] |
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