Comparison ledger
Applied Materials 0010-13622 RF Match for, Temescal FC-4400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | FC-4400Temescal |
|---|---|---|
| OEM | Applied Materials | Temescal |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2007 First version of manual |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Temescal FC-4400 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | FC-4400[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Brand | — | Temescal[2] |
| System type | — | Deposition system[3] |
| Process focus | — | Lift-off oriented evaporation[3] |
| Wafer capacity | — | Up to 30 x 150 mm wafers per load[3] |
| Product chamber type | — | Box[3] |
| Load lock | — | Present[3] |
| Cryopump water L/sec | — | 44,000[3] |
| Pump down time | — | 1E-06[3] |
| E-gun power supply | — | 6, 12, or 15 kW[3] |
| Ion gun | — | MKII HC[3] |
| Source-to-substrate distance | — | 38 in standard[3] |
| Source-to-substrate distance with extension collar | — | 42 in[3] |
| Product chamber dimensions | — | 23.5 in high x 44 in x 44 in[3] |
| Source tray diameter | — | 25.5 in[3] |
| System control | — | Temescal Control System (TCS)[3] |
| Control modes | — | Auto, Manual, and Service modes[3] |
| Process data logging | — | Supported[3] |
| Model designation listed | — | Temescal FC-4400[2] |
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