Comparison ledger
Applied Materials 0010-13622 RF Match for, Ulvac SME 200 J, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | SME 200 JUlvac |
|---|---|---|
| OEM | Applied Materials | Ulvac |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Ulvac SME 200 J |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Chamber Targets:[2] |
| Model | 0010-13622[1] | SME 200 J[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| PM2 | — | platinum[2] |
| PM3 | — | bst[2] |
| PM4 | — | no chamber[2] |
| PM5 | — | bst[2] |
| PM6 | — | bst[2] |
| Equipment type | — | Sputtering system[3] |
| Make | — | Ulvac[2] |
| Asset # | — | 129211[2] |
| Last confirm date | — | July 07, 2025[2] |
| Chamber targets | — | PM2: platinum; PM3: bst; PM4: no chamber; PM5: bst; PM6: bst[2] |
| Category | — | Deposition[3] |
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