Ulvac
SME 200 J
The Ulvac SME 200 J is a sputtering system. The Ulvac SME 200 J is categorized as deposition equipment. The Ulvac SME 200 J chamber targets are PM2 platinum, PM3 bst, PM4 no chamber, PM5 bst, and PM6 bst.[1][2][3]
What it is
The Ulvac SME 200 J is a sputtering system. The Ulvac SME 200 J is categorized under deposition equipment.[2][3]
How it works
General reference — not yet source-verifiedSputtering deposition uses a vacuum chamber, process gas, and a target made of the material to be deposited. Plasma ions strike the target and eject atoms that travel through the chamber and condense on the substrate. Process control in this class of equipment commonly centers on target selection, chamber condition, gas flow, pressure, power, and deposition time.
Where it fits in the process flow
General reference — not yet source-verifiedSputtering tools are used in thin-film module areas of microfabrication and related device manufacturing. A sputtering step commonly follows substrate preparation and commonly precedes patterning, etch, lift-off, anneal, or electrical stack completion, depending on the integration scheme. Sputtering is often chosen when a process flow requires a deposited layer before later structuring or encapsulation steps.
Applications
General reference — not yet source-verifiedSputtering systems are applied to the deposition of metals, oxides, and other functional thin films used in device stacks. Such tools are used for electrodes, contact layers, barrier layers, adhesion layers, and dielectric or functional films in semiconductor and related substrate-processing work.
What do the numbers mean?
Configuration & options13
- Chamber Targets:[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the SME 200 J are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SME 200 J are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SME 200 J are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SME 200 J are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SME 200 J are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SME 200 J is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]Ulvac SME 200 J family | Waferpedia — waferpedia.comwaferpedia.com
- [4]Inventory photo
Last updated Oct 19, 2026.
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