Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Applied Materials MxP+ Poly, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | MxP+ PolyApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Applied Materials MxP+ Poly |
| Cited variants | — |
|
| Specifications | ||
| Make | Applied Materials[2] | — |
| Model | 0010-22161[2] | — |
| Description | HTESC PH 1 REV A[3] | — |
| Condition | Used[3] | — |
| Stock Number | BM6628[3] | — |
| Wafer Size | — | 200mm[4] |
| Platform | — | Centura 5200[4] |
| Process Type | — | Polysilicon Etch[4] |
| Date of Manufacture | — | 1998[4] |
| Software Version | — | 4.9_15[4] |
| Orienter Quantity | — | 1[4] |
| MxP Poly Quantity | — | 1[4] |
| MxP+ Poly Quantity | — | 2[4] |
| eMxP+ ESC Quantity | — | 1[4] |
| End Point Detection | — | Monochromator[4] |
| Gases Used | — | NF3, CH3F, CL2, HBR, CHF3, AR, CF4, O2, N2, C4F8, CO, HE/O2[4] |
| MFCs | — | 32 Digital MFC's[4] |
| Robot | — | HP Robot[4] |
| Dry Pumps | — | 4-IQDP80, 2-IQDP80/WSU151[4] |
| Chillers | — | 5-Neslab-150[4] |
| Wafer Size (Asseta) | — | 6"[1] |
| ESC Type | — | Polymide[4] |