Waferpedia

Comparison ledger

0010 47763versusMT 50 E Milling

Applied Materials 0010 47763, Optimum MT 50 E Milling, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
OEMApplied MaterialsOptimum
CategoryEtch—
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Optimum MT 50 E Milling
Specifications
Configuration2nd Source New[1]—
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]MT 50 E[7]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Part number0010-47763[2]—
Component typeElectrostatic chuck (ESC) assembly[4]—
DesignationASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Wafer size reference300 mm[5]—
Associated part number0041-39086[6]—
Make—Optimum[7]
Asset name—Optimum MT 50 E Milling Machine[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]powerdukedcs.compowerdukedcs.com
  6. [6]ygplc.comygplc.com
  7. [7]Equipment inventory listing