Waferpedia

Comparison ledger

0020 12458 PartversusFC-4400

Applied Materials 0020 12458 Part, Temescal FC-4400, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
0020 12458 PartApplied Materials
FC-4400Temescal
OEMApplied MaterialsTemescal
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2007 First version of manual
Control system——
Generation——
FamilyApplied Materials 0020 12458 PartTemescal FC-4400
Specifications
ConfigurationInsulator,Side Match,Hdp-Cvd Ultima Plus[1]—
Asset number146526[1]—
MakeApplied Materials[1]—
Model0020 12458[1]FC-4400[2]
Brand—Temescal[2]
System type—Deposition system[3]
Process focus—Lift-off oriented evaporation[3]
Wafer capacity—Up to 30 x 150 mm wafers per load[3]
Product chamber type—Box[3]
Load lock—Present[3]
Cryopump water L/sec—44,000[3]
Pump down time—1E-06[3]
E-gun power supply—6, 12, or 15 kW[3]
Ion gun—MKII HC[3]
Source-to-substrate distance—38 in standard[3]
Source-to-substrate distance with extension collar—42 in[3]
Product chamber dimensions—23.5 in high x 44 in x 44 in[3]
Source tray diameter—25.5 in[3]
System control—Temescal Control System (TCS)[3]
Control modes—Auto, Manual, and Service modes[3]
Process data logging—Supported[3]
Model designation listed—Temescal FC-4400[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]temescal.ferrotec.comtemescal.ferrotec.com