Waferpedia

Comparison ledger

0020 17484 PartversusSSC-600

Applied Materials 0020 17484 Part, CHA SSC-600, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
0020 17484 PartApplied Materials
OEMApplied MaterialsCHA
CategoryDepositionDeposition
Wafer size—6 in. system
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17484 PartCHA SSC-600
Specifications
ConfigurationBar, Cap Bank, Hdpcvd 300mm Ultima X[1]—
System type—Sputtering System[2]
Wafer size—6 in. system[2]
Operation—Sputter up or sputter down operations[2]
Baseplates—Upper and lower baseplates[2]
Cathodes—Up to four DC or RF cathodes[2]
Fixture—Single plane, multi substrate rotating fixture[2]
Control—Computer control[2]
Tool type—Sputtering system[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org